Intel Core2 Extreme Processor QX9775 Thermal and Mechanical Design Guidelines Addendum

LGA775 Socket Heatsink Loading
Thermal and Mechanical Design Guidelines 65
Figure 24. Board Deflection Definition
d1
d2
d’1
d’2
A.2.3 Board Deflection Limits
Deflection limits for the ATX/µATX form factor are:
d_BOL - d_ref ≥ 0.09 mm and d_EOL - d_ref ≥ 0.15 mm
And
d’_BOL – d’_ref ≥ 0.09 mm and d_EOL’ – d_ref’ ≥ 0.15 mm
NOTES:
1. The heatsink preload must remain within the static load limits defined in the processor
datasheet at all times.
2. Board deflection should not exceed motherboard manufacturer specifications.