Intel® Core™2 Extreme QuadCore Processor and Intel® Core™2 Quad Processor Thermal and Mechanical Design Guidelines Supporting: Intel® Core™2 Extreme quad-core processor QX6000Δ series at 775_VR_CONFIG_05B Intel® Core™2 Quad processor Q6000Δ series at 105 W Intel® Core™2 Quad processor Q6000Δ series at 95 W Intel® Core™2 Extreme Processor QX9000series at 775_VR_CONFIG_05B Intel® Core™2 Quad processor Q9000and Q9000S series Intel® Core™2 Quad processor Q8000 and Q8000S series Aug
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Contents 1 Introduction ...................................................................................................11 1.1 1.2 1.3 2 Processor Thermal/Mechanical Information .........................................................17 2.1 2.2 2.3 2.4 2.5 3 Mechanical Requirements ......................................................................17 2.1.1 Processor Package...................................................................17 2.1.2 Heatsink Attach .............................
.2.5 4.2.6 4.2.7 4.2.8 4.2.9 4.2.10 5 Intel® Thermal/Mechanical Reference Design Information .....................................43 5.1 5.2 5.3 5.4 5.5 5.6 5.7 6 6.2 6.3 6.4 A.3 LGA775 Socket Heatsink Considerations ..................................................63 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference Design .................................................................................63 A.2.1 Heatsink Preload Requirement Limitations............
B.2 B.3 Appendix C Thermal Interface Management.........................................................................75 C.1 C.2 C.3 Appendix D Test Preparation...................................................................................69 B.2.1 Heatsink Preparation................................................................69 B.2.2 Typical Test Equipment ............................................................72 Test Procedure Examples...................................................
Figures Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure 6 1. Package IHS Load Areas .....................................................................17 2.
Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure 52. 53. 54. 55. 56. 57. 58. Application of Accelerant ...................................................................95 Removing Excess Adhesive from IHS ..................................................95 Finished Thermocouple Installation .....................................................96 Thermocouple Wire Management............
Tables Table 1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions...............27 Table 2. Heatsink Inlet Temperature of Intel® Boxed Processor thermal solutions .....27 Table 3. ATX Reference Heatsink Performance (RCFH-4) for 775_VR_CONFIG 05B Processors .........................................................................................45 Table 4. ATX Reference Heatsink Performance (D60188-001) for Listed Processors at 95 W...............................................................
Revision History Revision Number Description -001 Initial Release. -002 Added specifications for Intel® Core™2 Quad Processor Q6600 -003 Updated QX6800 series at the 775_VR_CONFIG_05B thermal information Date November 2006 January 2007 July 2007 Updated Q6000 series at 105 W thermal information Updated TC attach procedure for the new groove direction Added Q6000 series at 95 W thermal information Added D60188-001 reference design -004 Added Q6600 at 95 W.
Thermal and Mechanical Design Guidelines
Introduction 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within their functional temperature range. Within this temperature range, a component is expected to meet its specified performance. Operation outside the functional temperature range can degrade system performance, cause logic errors or cause component and/or system damage.
Introduction 1.1.
Introduction The physical dimensions and thermal specifications of the processor that are used in this document are for illustration only. Refer to the datasheet for the product dimensions, thermal power dissipation and maximum case temperature. In case of conflict, the data in the datasheet supersedes any data in this document. 1.2 References Material and concepts available in the following documents may be beneficial when reading this document.
Introduction 1.3 Definition of Terms Term ACPI Advanced Configuration and Power Interface. BTX Balanced Technology Extended Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface. DTS Digital Thermal Sensor: Processor die sensor temperature defined as an offset from the onset of PROCHOT#.
Introduction Term Thermal Monitor Description A feature on the processor that attempts to keep the processor die temperature within factory specifications. TIM Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink. TMA Thermal Module Assembly.
Introduction 16 Thermal and Mechanical Design Guidelines
Processor Thermal/Mechanical Information 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The processors covered in the document are in a 775-Land LGA package that interfaces with the motherboard via a LGA775 socket. Refer to the datasheet for detailed mechanical specifications. The processor connects to the motherboard through a land grid array (LGA) surface mount socket.
Processor Thermal/Mechanical Information The primary function of the IHS is to transfer the non-uniform heat distribution from the die to the top of the IHS, out of which the heat flux is more uniform and spread over a larger surface area (not the entire IHS area). This allows more efficient heat transfer out of the package to an attached cooling device. The top surface of the IHS is designed to be the interface for contacting a heatsink.
Processor Thermal/Mechanical Information 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines There are no features on the LGA775 socket to directly attach a heatsink: a mechanism must be designed to attach the heatsink directly to the motherboard.
Processor Thermal/Mechanical Information 2.1.2.3 Additional Guidelines In addition to the general guidelines given above, the heatsink attach mechanism for the processor should be designed to the following guidelines: 2.2 Holds the heatsink in place under mechanical shock and vibration events and applies force to the heatsink base to maintain desired pressure on the thermal interface material.
Processor Thermal/Mechanical Information Figure 2. Processor Case Temperature Measurement Location 37.5 mm Measure TC at this point (geometric center of the package) 37.5 mm 2.2.2 Thermal Profile The Thermal Profile defines the maximum case temperature as a function of processor power dissipation (refer to the datasheet for further information). The TDP and Maximum Case Temperature are defined as the maximum values of the thermal profile.
Processor Thermal/Mechanical Information For ATX platforms using the Intel® Core™2 Quad processor Q6000 series at 95 W, an active air-cooled design, assumed be used in ATX Chassis, with a fan installed at the top of the heatsink equivalent to the D60188-001 reference design (see Chapter 5) should be designed to manage the processor TDP at an inlet temperature of 35 ºC + 5 ºC = 40 ºC.
Processor Thermal/Mechanical Information Figure 3. Example Thermal Profile 2.2.3 TCONTROL TCONTROL defines the maximum operating temperature for the digital thermal sensor when the thermal solution fan speed is being controlled by the digital thermal sensor. The TCONTROL parameter defines a very specific processor operating region where fan speed can be reduced.
Processor Thermal/Mechanical Information control component. See the appropriate processor datasheet for further details on reading the register and calculating TCONTROL. See Chapter 6 Intel® Quiet System Technology (Intel® QST) for details on implementing a design using TCONTROL and the Thermal Profile. 2.3 Heatsink Design Considerations To remove the heat from the processor, three basic parameters should be considered: The area of the surface on which the heat transfer takes place.
Processor Thermal/Mechanical Information 2.3.1 Heatsink Size The size of the heatsink is dictated by height restrictions for installation in a system and by the real estate available on the motherboard and other considerations for component height and placement in the area potentially impacted by the processor heatsink. The height of the heatsink must comply with the requirements and recommendations published for the motherboard form factor of interest.
Processor Thermal/Mechanical Information reviewed in depth in the Balanced Technology Extended (BTX) System Design Guide v1.0. Note: The 550g mass limit for ATX solutions is based on the capabilities of the reference design components that retain the heatsink to the board and apply the necessary preload. Any reuse of the clip and fastener in derivative designs should not exceed 550g.
Processor Thermal/Mechanical Information 2.4 System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities The Intel reference thermal solutions and Intel® Boxed Processor thermal solutions assume that the chassis delivers a maximum TA at the inlet of the processor fan heatsink. The following tables show the TA requirements for the reference solutions and Intel® Boxed Processor thermal solutions. Table 1.
Processor Thermal/Mechanical Information ATX Thermal Design Suggestions or microATX Thermal Design Suggestions or Balanced Technology Extended (BTX) System Design Guide v1.0 documents available on the http://www.formfactors.org/ web site. In addition to passive heatsinks, fan heatsinks and system fans are other solutions that exist for cooling integrated circuit devices. For example, ducted blowers, heat pipes and liquid cooling are all capable of dissipating additional heat.
Thermal Metrology 3 Thermal Metrology This chapter discusses guidelines for testing thermal solutions, including measuring processor temperatures. In all cases, the thermal engineer must measure power dissipation and temperature to validate a thermal solution. To define the performance of a thermal solution the “thermal characterization parameter”, (“psi”) will be used. 3.
Thermal Metrology The case-to-local ambient thermal characterization parameter of the processor, CA, is comprised of CS, the thermal interface material thermal characterization parameter, and of SA, the sink-to-local ambient thermal characterization parameter: CA = CS + SA (Equation 2) Where: CS = Thermal characterization parameter of the thermal interface material (°C/W) SA = Thermal characterization parameter from heatsink-to-local ambient (°C/W) CS is strongly dependent on the thermal conducti
Thermal Metrology 3.1.1 Example The cooling performance, CA, is then defined using the principle of thermal characterization parameter described above: The case temperature TC-MAX and thermal design power TDP given in the processor datasheet. Define a target local ambient temperature at the processor, TA.
Thermal Metrology 3.3 Local Ambient Temperature Measurement Guidelines The local ambient temperature TA is the temperature of the ambient air surrounding the processor. For a passive heatsink, TA is defined as the heatsink approach air temperature; for an actively cooled heatsink, it is the temperature of inlet air to the active cooling fan. It is worthwhile to determine the local ambient temperature in the chassis around the processor to understand the effect it may have on the case temperature.
Thermal Metrology Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink NOTE: Drawing Not to Scale Figure 6.
Thermal Metrology 3.4 Processor Case Temperature Measurement Guidelines To ensure functionality and reliability, the processor is specified for proper operation when TC is maintained at or below the thermal profile as listed in the datasheet. The measurement location for TC is the geometric center of the IHS. Figure 2 shows the location for TC measurement. Special care is required when measuring TC to ensure an accurate temperature measurement. Thermocouples are often used to measure TC.
Thermal Management Logic and Thermal Monitor Feature 4 Thermal Management Logic and Thermal Monitor Feature 4.1 Processor Power Dissipation An increase in processor operating frequency not only increases system performance, but also increases the processor power dissipation. The relationship between frequency and power is generalized in the following equation: P = CV2F (where P = power, C = capacitance, V = voltage, F = frequency).
Thermal Management Logic and Thermal Monitor Feature 4.2.1 PROCHOT# Signal The primary function of the PROCHOT# signal is to provide an external indication the processor has reached the TCC activation temperature. While PROCHOT# is asserted, the TCC will be active. Assertion of the PROCHOT# signal is independent of any register settings within the processor. It is asserted any time the processor die temperature reaches the trip point.
Thermal Management Logic and Thermal Monitor Feature Figure 7. Thermal Monitor Control PROCHOT# Normal clock Internal clock Duty cycle control Resultant internal clock 4.2.2.2 Thermal Monitor 2 (TM2) The second method of power reduction is TM2. TM2 provides an efficient means of reducing the power consumption within the processor and limiting the processor temperature. When TM2 is enabled, and a high temperature situation is detected, the enhanced TCC will be activated.
Thermal Management Logic and Thermal Monitor Feature Once the processor has sufficiently cooled, and a minimum activation time has expired, the operating frequency and voltage transition back to the normal system operating point. Transition of the VID code will occur first, in order to insure proper operation once the processor reaches its normal operating frequency. Refer to Figure 8 for an illustration of this ordering. Figure 8.
Thermal Management Logic and Thermal Monitor Feature Regardless of the configuration selected, PROCHOT# will always indicate the thermal status of the processor. The power reduction mechanism of thermal monitor can also be activated manually using an “on-demand” mode. Refer to Section 4.2.4 for details on this feature. 4.2.4 On-Demand Mode For testing purposes, the thermal control circuit may also be activated by setting bits in the ACPI MSRs. The MSRs may be set based on a particular system event (e.g.
Thermal Management Logic and Thermal Monitor Feature control circuit to activate under normal operating conditions. Systems that do not meet these specifications could be subject to more frequent activation of the thermal control circuit depending upon ambient air temperature and application power profile.
Thermal Management Logic and Thermal Monitor Feature 4.2.9 Digital Thermal Sensor Multiple digital thermal sensors can be implemented within the package without adding a pair of signal pins per sensor as required with the thermal diode. The digital thermal sensor is easier to place in thermally sensitive locations of the processor than the thermal diode. This is achieved due to a smaller foot print and decreased sensitivity to noise.
Thermal Management Logic and Thermal Monitor Feature 4.2.10 Platform Environmental Control Interface (PECI) The PECI interface is a proprietary single wire bus between the processor and the chipset or other health monitoring device. At this time the digital thermal sensor is the only data being transmitted. For an overview of the PECI interface see PECI Feature Set Overview. For additional information on the PECI, see the Datasheet. The PECI bus is available on pin G5 of the LGA 775 socket.
Intel® Thermal/Mechanical Reference Design Information 5 Intel® Thermal/Mechanical Reference Design Information 5.1 ATX Reference Design Requirements This chapter will document the requirements for an active air-cooled design, with a fan installed at the top of the heatsink. The thermal technology required for the processor.
Intel® Thermal/Mechanical Reference Design Information The Intel® Core™2 Quad processor Q6000 series at 105 W requires a thermal solution equivalent to the RCBFH-3 reference design, see Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal and Mechanical Design Guidelines for a complete description of this reference design.
Intel® Thermal/Mechanical Reference Design Information The D60188-001 reference design takes advantage of the cost saving for the light fan/heatsink mass (450g) and the new TIM material (Dow Corning TC-1996 grease). A bottom view of the copper core applied by this grease is provided in Figure 12. Figure 12. Bottom View of Copper Core Applied by TC-1996 Grease The ATX motherboard keep-out and the height recommendations defined in Section 5.
Intel® Thermal/Mechanical Reference Design Information Table 4. ATX Reference Heatsink Performance (D60188-001) for Listed Processors at 95 W Processor Target Thermal Performance, ca (Mean + 3) TA Assumption Notes Intel® Core™2 Quad Processor Q6000 series at 95 W and Intel® Core™2 Quad processor Q9000 and Q8000 series at 95 W 0.33 C/W TA = 40 C 1 NOTES: 1. Performance targets (Ψ ca) as measured with a live processor at TDP. 5.2.
Intel® Thermal/Mechanical Reference Design Information While the fan hub thermistor helps optimize acoustics at high processor workloads by adapting the maximum fan speed to support the processor thermal profile, additional acoustic improvements can be achieved at lower processor workload by using the TCONTROL specifications described in Section 2.2.3.
Intel® Thermal/Mechanical Reference Design Information 5.2.5 Fan Performance for Active Heatsink Thermal Solution The fan power requirements for proper operation are given Table 7. Table 7. Fan Electrical Performance Requirements Requirement Value Maximum Average fan current draw 1.5 A Fan start-up current draw 2.2 A Fan start-up current draw maximum duration 1.
Intel® Thermal/Mechanical Reference Design Information 5.3 Environmental Reliability Testing 5.3.1 Structural Reliability Testing Structural reliability tests consist of unpackaged, board-level vibration and shock tests of a given thermal solution in the assembled state. The thermal solution should meet the specified thermal performance targets after these tests are conducted; however, the test conditions outlined here may differ from your own system requirements. 5.3.1.
Intel® Thermal/Mechanical Reference Design Information Figure 14. Shock Acceleration Curve A c c e l e r a t i o n (g) 60 50 40 30 20 10 0 0 2 4 6 8 10 12 Time (m illiseconds) 5.3.1.2.1 Recommended Test Sequence Each test sequence should start with components (i.e. motherboard, heatsink assembly, etc.) that have never been previously submitted to any reliability testing.
Intel® Thermal/Mechanical Reference Design Information 5.3.2 Power Cycling Thermal performance degradation due to TIM degradation is evaluated using power cycling testing. The test is defined by 7500 cycles for the case temperature from room temperature (~23 ºC) to the maximum case temperature defined by the thermal profile at TDP. Thermal Test Vehicle is used for this test. 5.3.
Intel® Thermal/Mechanical Reference Design Information 5.5 Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards: 5.6 UL Recognition-approved for flammability at the system level. All mechanical and thermal enabling components must be a minimum UL94V-2 approved. CSA Certification. All mechanical and thermal enabling components must have CSA certification.
Intel® Thermal/Mechanical Reference Design Information 5.7 Reference Attach Mechanism 5.7.1 Structural Design Strategy Structural design strategy for the reference design is to minimize upward board deflection during shock to help protect the LGA775 socket. The reference design uses a high clip stiffness that resists local board curvature under the heatsink, and minimizes, in particular, upward board deflection (Figure 15). In addition, a moderate preload provides initial downward deflection.
Intel® Thermal/Mechanical Reference Design Information 5.7.2 Mechanical Interface to the Reference Attach Mechanism The attach mechanism component from the reference design can be used by other 3rd party cooling solutions. The attach mechanism consists of: A metal attach clip that interfaces with the heatsink core, see Appendix F Figure 66 and Figure 67 for the component drawings. Four plastic fasteners, see Figure 68, Figure 69, Figure 70, and Figure 71 for the component drawings.
Intel® Thermal/Mechanical Reference Design Information Figure 17. Critical Parameters for Interfacing to Reference Clip Fan Fin Array Core See Detail A Clip Fin Array Clip 1.6 mm Core Detail A Figure 18. Critical Core Dimension 38.68 +/- 0.30 mm 36.14 +/- 0.10 mm Gap required to avoid core surface blemish during clip assembly. Recommend 0.3 mm min. 1.00 +/- 0.10 mm Core 1.00 mm min R 0.40 mm max R 0.40 mm max 2.596 +/- 0.
Intel® Thermal/Mechanical Reference Design Information 56 Thermal and Mechanical Design Guidelines
Intel® Quiet System Technology (Intel® QST) 6 Intel® Quiet System Technology (Intel® QST) In the Intel® 965 Express chipset family a new control algorithm for fan speed control is being introduced. It is composed of a Manageability Engine (ME) in the Graphics Memory Controller Hub (GMCH) which executes the Intel® Quiet System Technology (Intel® QST) algorithm and the ICH8 containing the sensor bus and fan control circuits.
Intel® Quiet System Technology (Intel® QST) Figure 19. Intel® Quiet System Technology Overview 6.1.1 Output Weighting Matrix Intel QST provides an Output Weighting Matrix that provides a means for a single thermal sensor to affect the speed of multiple fans. An example of how the matrix could be used is if a sensor located next to the memory is sensitive to changes in both the processor heatsink fan and a 2nd fan in the system.
Intel® Quiet System Technology (Intel® QST) Figure 20. PID Controller Fundamentals Integral (time averaged) Temperature Actual Temperature Limit Temperature + dPWM Derivative (Slope) Time RPM - dPWM Proportional Error Fan Speed For a PID algorithm to work, limit temperatures are assigned for each temperature sensor. For Intel QST, the TCONTROL for the processor and chipset are to be used as the limit temperature.
Intel® Quiet System Technology (Intel® QST) 6.
Intel® Quiet System Technology (Intel® QST) Figure 22 shows the major connections for a typical implementation that can support processors with digital thermal sensor or a thermal diode. In this configuration a SST Thermal Sensor has been added to read the on-die thermal diode that is in all of the processors in the 775-land LGA packages shipped before the Intel® Core™2 Duo. With the proper configuration information the ME can be accommodate inputs from PECI or SST for the processor socket.
Intel® Quiet System Technology (Intel® QST) 6.3 Intel® QST Configuration and Tuning Initial configuration of the Intel QST is the responsibility of the board manufacturer. The SPI flash should be programmed with the hardware configuration of the motherboard and initial settings for fan control, fan monitoring, voltage and thermal monitoring.
LGA775 Socket Heatsink Loading Appendix A LGA775 Socket Heatsink Loading A.1 LGA775 Socket Heatsink Considerations Heatsink clip load is traditionally used for: Mechanical performance in mechanical shock and vibration Refer to Section 5.7.
LGA775 Socket Heatsink Loading Simulation shows that the solder joint force (Faxial) is proportional to the board deflection measured along the socket diagonal. The matching of Faxial required to protect the LGA775 socket solder joint in temperature cycling is equivalent to matching a target MB deflection.
LGA775 Socket Heatsink Loading Figure 24. Board Deflection Definition d’1 d1 d2 d’2 A.2.3 Board Deflection Limits Deflection limits for the ATX/µATX form factor are: d_BOL - d_ref ≥ 0.09 mm and d_EOL - d_ref ≥ 0.15 mm And d’_BOL – d’_ref ≥ 0.09 mm and d_EOL’ – d_ref’ ≥ 0.15 mm NOTES: 1. The heatsink preload must remain within the static load limits defined in the processor datasheet at all times. 2. Board deflection should not exceed motherboard manufacturer specifications.
LGA775 Socket Heatsink Loading A.2.4 Board Deflection Metric Implementation Example This section is for illustration only, and relies on the following assumptions: 72 mm x 72 mm hole pattern of the reference design Board stiffness = 900 lb/in at BOL, with degradation that simulates board creep over time Though these values are representative, they may change with selected material and board manufacturing process. Check with your motherboard vendor. Clip stiffness assumed constant – No creep.
LGA775 Socket Heatsink Loading Figure 25. Example: Defining Heatsink Preload Meeting Board Deflection Limit A.2.5 Additional Considerations Intel recommends to design to {d_BOL – d_ref = 0.15mm} at BOL when EOL conditions are not known or difficult to assess. The following information is given for illustration only. It is based on the reference keep-out, assuming there is no fixture that changes board stiffness. d_ref is expected to be 0.18 mm on average, and be as high as 0.22 mm.
LGA775 Socket Heatsink Loading A.2.5.1 Motherboard Stiffening Considerations To protect LGA775 socket solder joint, designers need to drive their mechanical design to: Allow downward board deflection to put the socket balls in a desirable force state to protect against fatigue failure of socket solder joint (refer to Sections A.2.1, A.2.2, and A.2.3.
Heatsink Clip Load Metrology Appendix B Heatsink Clip Load Metrology B.1 Overview This section describes a procedure for measuring the load applied by the heatsink/clip/fastener assembly on a processor package. This procedure is recommended to verify the preload is within the design target range for a design, and in different situations. For example: Heatsink preload for the LGA775 socket Quantify preload degradation under bake conditions.
Heatsink Clip Load Metrology Remarks: Alternate Heatsink Sample Preparation As mentioned above, making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results.
Heatsink Clip Load Metrology Figure 27. Load Cell Installation in Machined Heatsink Base Pocket (Side View) Wax to maintain load cell in position during heatsink installation Height of pocket ~ height of selected load cell Load cell protrusion (Note: to be optimized depending on assembly stiffness) Figure 28.
Heatsink Clip Load Metrology B.2.2 Typical Test Equipment For the heatsink clip load measurement, use equivalent test equipment to the one listed Table 9. Table 9. Typical Test Equipment Item Load cell Notes: 1, 5 Description Part Number (Model) Honeywell*-Sensotec* Model 13 subminiature load cells, compression only AL322BL Select a load range depending on load level being tested. www.sensotec.
Heatsink Clip Load Metrology B.3.1 B.3.2 Time-Zero, Room Temperature Preload Measurement 1. Pre-assemble mechanical components on the board as needed prior to mounting the motherboard on an appropriate support fixture that replicate the board attach to a target chassis For example: standard ATX board should sit on ATX compliant stand-offs.
Heatsink Clip Load Metrology 74 Thermal and Mechanical Design Guidelines
Thermal Interface Management Appendix C Thermal Interface Management To optimize a heatsink design, it is important to understand the impact of factors related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface material area and interface material thermal conductivity should be managed to realize the most effective thermal solution. C.
Thermal Interface Management § 76 Thermal and Mechanical Design Guidelines
Case Temperature Reference Metrology Appendix D Case Temperature Reference Metrology D.1 Objective and Scope This appendix defines a reference procedure for attaching a thermocouple to the IHS of a 775-land LGA package for TC measurement. This procedure takes into account the specific features of the 775-land LGA package and of the LGA775 socket for which it is intended. The recommended equipment for the reference thermocouple installation, including tools and part numbers are also provided.
Case Temperature Reference Metrology Item Description Part Number Calibration and Control Ice Point Cell Omega*, stable 0 ºC temperature source for calibration and offset TRCIII Hot Point Cell Omega *, temperature source to control and understand meter slope gain CL950-A-110 NOTES: 1. The Solder Station consisting of the Heater Block, Heater, Press and Transformer are available from Jemelco Engineering 480-804-9514 2.
Case Temperature Reference Metrology D.4 IHS Groove Cut a groove in the package IHS; see the drawings given in Figure 30 and Figure 31. The groove orientation in Figure 30 is toward the IHS notch to allow the thermocouple wire to be routed under the socket lid. This will protect the thermocouple from getting damaged or pinched when removing and installing the heatsink (see Figure 55).
Figure 30.
Thermal and Mechanical Design Guidelines Figure 31.
Case Temperature Reference Metrology The orientation of the groove at 6 o’clock exit relative to the package pin 1 indicator (gold triangle in one corner of the package) is shown in Figure 32 for the 775-Land LGA package IHS. Figure 32. IHS Groove at 6 o’clock Exit on the 775-LAND LGA Package IHS Groove Pin1 indicator When the processor is installed in the LGA775 socket, the groove is parallel to the socket load lever, and is toward the IHS notch, as shown in Figure 33. Figure 33.
Case Temperature Reference Metrology D.5 Thermocouple Attach Procedure The procedure to attach a thermocouple with solder takes about 15 minutes to complete. Before proceeding turn on the solder block heater, as it can take up to 30 minutes to reach the target temperature of 153 – 155 °C. Note: To avoid damage to the TTV or processor ensure the IHS temperature does not exceed 155 °C. As a complement to the written procedure a video Thermocouple Attach Using Solder – Video CD-ROM is available. D.5.
Case Temperature Reference Metrology Figure 35. Bending the Tip of the Thermocouple D.5.2 Thermocouple Attachment to the IHS 6. Clean groove and IHS with Isopropyl Alcohol (IPA) and a lint free cloth removing all residues prior to thermocouple attachment. 7. Place the thermocouple wire inside the groove; letting the exposed wire and bead extend about 1.5 mm [0.030 inch] past the end of groove. Secure it with Kapton* tape (see Figure 36). Clean the IHS with a swab and IPA. 8.
Case Temperature Reference Metrology 9. Lift the wire at the middle of groove with tweezers and bend the front of wire to place the thermocouple in the groove ensuring the tip is in contact with the end and bottom of the groove in the IHS (see Figure 37-A and B). Figure 37. Thermocouple Bead Placement (A) (B) 10. Place the package under the microscope to continue with process.
Case Temperature Reference Metrology 11. While still at the microscope, press the wire down about 6mm [0.125”] from the thermocouple bead using the tweezers or your finger. Place a piece of Kapton* tape to hold the wire inside the groove (see Figure 38). Refer to Figure 39 for detailed bead placement. Figure 38. Position Bead on the Groove Step Kapton* tape Wire section into the groove to prepare for final bead placement Figure 39.
Case Temperature Reference Metrology Figure 40. Third Tape Installation 12. Place a 3rd piece of tape at the end of the step in the groove as shown in Figure 40. This tape will create a solder dam to prevent solder from flowing into the larger IHS groove section during the melting process. 13. Measure resistance from thermocouple end wires (hold both wires to a DMM probe) to the IHS surface. This should be the same value as measured during the thermocouple conditioning step D.5.1.
Case Temperature Reference Metrology 14. Using a fine point device, place a small amount of flux on the thermocouple bead. Be careful not to move the thermocouple bead during this step (see Figure 42). Ensure the flux remains in the bead area only. Figure 42. Applying Flux to the Thermocouple Bead 15. Cut two small pieces of solder 1/16 inch (0.065 inch / 1.5 mm) from the roll using tweezers to hold the solder while cutting with a fine blade (see Figure 43) Figure 43.
Case Temperature Reference Metrology 16. Place the two pieces of solder in parallel, directly over the thermocouple bead (see Figure 44) Figure 44. Positioning Solder on IHS 17. Measure the resistance from the thermocouple end wires again using the DMM (refer to Section D.5.1.step 2) to ensure the bead is still properly contacting the IHS. D.5.3 Solder Process 18. Make sure the thermocouple that monitors the Solder Block temperature is positioned on the Heater block.
Case Temperature Reference Metrology Figure 45. Solder Station Setup 21. Remove the land side protective cover and place the device to be soldered in the solder station. Make sure the thermocouple wire for the device being soldered is exiting the heater toward you. Note: Do not touch the copper heater block at any time as this is very hot. 22. Move a magnified lens light close to the device in the solder status to get a better view when the solder begins to melt. 23. Lower the Heater block onto the IHS.
Case Temperature Reference Metrology 24. You may need to move the solder back toward the groove as the IHS begins to heat. Use a fine tip tweezers to push the solder into the end of the groove until a solder ball is built up (see Figure 46 and Figure 47). Figure 46. View Through Lens at Solder Station Figure 47.
Case Temperature Reference Metrology 25. Lift the heater block and magnified lens, using tweezers quickly rotate the device 90 degrees clockwise. Using the back of the tweezers press down on the solder this will force out the excess solder. Figure 48. Removing Excess Solder 26. Allow the device to cool down. Blowing compressed air on the device can accelerate the cooling time.
Case Temperature Reference Metrology Figure 49. Thermocouple Placed into Groove 29. Using a blade carefully shave the excess solder above the IHS surface. Only shave in one direction until solder is flush with the groove surface (see Figure 50). Figure 50. Removing Excess Solder Note: Take usual precautions when using open blades. 30. Clean the surface of the IHS with Alcohol and use compressed air to remove any remaining contaminants. 31. Fill the rest of the groove with Loctite* 498 Adhesive.
Case Temperature Reference Metrology Figure 51. Filling Groove with Adhesive 32. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive and let it set for a couple of minutes (see Figure 52). Figure 52. Application of Accelerant Figure 53.
Case Temperature Reference Metrology 33. Using a blade, carefully shave any adhesive that is above the IHS surface (see Figure 53). The preferred method is to shave from the edge to the center of the IHS. Note: The adhesive shaving step should be performed while the adhesive is partially cured, but still soft. This will help to keep the adhesive surface flat and smooth with no pits or voids. If there are voids in the adhesive, refill the voids with adhesive and shave a second time. 34.
Case Temperature Reference Metrology Figure 55.
Case Temperature Reference Metrology 98 Thermal and Mechanical Design Guidelines
Balanced Technology Extended (BTX) System Thermal Considerations Appendix E Balanced Technology Extended (BTX) System Thermal Considerations There are anticipated system operating conditions in which the processor power may be low but other system component powers may be high. If the only Fan Speed Control (FSC) circuit input for the Thermal Module Assembly (TMA) fan is from the processor diode then the fan speed and system airflow is likely to be too low in this operating state.
Balanced Technology Extended (BTX) System Thermal Considerations The thermal sensor location and elevation are reflected in the Flotherm thermal model airflow illustration and pictures (see Figure 56 and Figure 57).The Intel Boxed Boards in BTX form factor have implemented a System Monitor thermal sensor. The following thermal sensor or its equivalent can be used for this function: Part Number: C83274-002 BizLink USA Technology, Inc.
Balanced Technology Extended (BTX) System Thermal Considerations Figure 57.
Balanced Technology Extended (BTX) System Thermal Considerations 102 Thermal and Mechanical Design Guidelines
Mechanical Drawings Appendix F Mechanical Drawings The following table lists the mechanical drawings included in this appendix. These drawings refer to the reference thermal mechanical enabling components for the processor. Note: Intel reserves the right to make changes and modifications to the design as necessary.
45.26 47.50 41.00 36.78 36.00 24.51 A 27.00 23.47 47.50 45.26 44.00 40.00 36.78 36.49 39.01 36.00 33.00 32.51 27.51 ( 19.13 ) 0.00 2 PACKAGE BOUNDARY SOCKET BALL 1 5.90 ( 37.50 ) 7.30 8 7 6 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2 GEOMETRIC CENTER OF CPU PACKAGE / SOCKET HOUSING CAVITY. 3. BOARD COMPONENET KEEP-INS AND MECHANICAL COMPONENET KEEP-OUTS TO BE UTILIZED WITH SUFFICIENT ALLOWANCES FOR PLACEMENT AND SIZE TOLERANCES, ASSEMBLY PROCESS ACCESS, AND DYNAMIC EXCURSIONS. 4.
4X 8 6.00 7 10.00 LEGEND 7 ROUTING KEEP-OUT COMPONENT KEEP-OUT 4X 6 DISCLOSED IN CONFIDENCE AND ITS CONT OR WRITTEN CONSENT OF INTEL CORPORAT 6 BOARD SECONDARY SIDE ION CONFIDENTIAL INFORMATION. IT IS SPLAYED OR MODIFIED, WITHOUT THE PRI Thermal and Mechanical Design Guidelines A B C D THIS DRAWING CONTAINS INTEL CORPORAT MAY NOT BE DISCLOSED, REPRODUCED, DI 8 5 ENTS ION.
A B C D 2.50 2.75 5.80 45 X 3.50 3.00 37.00 7 27.25 SECTION 49.00 6 A-A 8 7 6 5.80 3.80 3.00 A 32.85 29.00 2X 45 X 3.00 5 ENTS ION. 4 R49.44 5 ( 46.11 ) 1.00 120.0 R33.29 4 TOP SIDE VIEW 8.15 3.80 30.00 2 14.10 ( 37.60 ) 6.60 SOCKET & PROCESSOR VOLUMETRIC KEEP-IN DISCLOSED IN CONFIDENCE AND ITS CONT OR WRITTEN CONSENT OF INTEL CORPORAT LEVER MOTION SPACE REQUIRED TO RELEASE SOCKET LOAD PLATE 3.00 24.50 ION CONFIDENTIAL INFORMATION.
Thermal and Mechanical Design Guidelines Figure 61.
Thermal and Mechanical Design Guidelines Figure 62.
Thermal and Mechanical Design Guidelines Figure 63.
Thermal and Mechanical Design Guidelines Figure 64.
Thermal and Mechanical Design Guidelines Figure 65.
A B C D E F G H 94.62 [ 3.725 ] A 7 SEE DETAIL C 8 PERMANENTLY MARK PART NUMBER AND REVISION LEVEL APPROXIMATELY WHERE SHOWN XXXXXX-XXX REV XX 7 39.6 [ 1.559 ] 7 7 SEE DETAIL B 94.62 [ 3.725 ] 8 B 6 SECTION 6 Figure 66. ATX Reference Clip – Sheet 1 A-A 5 5 D 5 0.2 .007 ] 36.44 [ 1.435 7 0.5 [.019] SQ 53.5 0.2 [ 2.106 .007 ] D A B 0.5 [.019] 4X 10 0.2 [ .394 .007 ] A B 3 2 0.2 [ .079 7 A 3.52 0.2 [ .139 .007 ] .007 ] A SEE DETAIL 2 DWG.
5.3 [ .209 ] 135 6 8 7 6 W 1.06 [ .042 ] 0.1 [.003] 0.2 [.007] BOUNDARY 7 2X R3.6 [ .142 ] R0.3 TYP [ .012 ] 1.65 [ .065 ] 5 5 R3.1 [ .122 ] THIS POINT CORRESPONDS TO THE 39.6 DIMENSION ON SHEET 1 ZONE A7 DETAIL A SCALE 10 TYPICAL 4 PLACES 7.35 [ .289 ] 2X R0.5 [ .020 ] 7.31 [ .288 ] 7 Thermal and Mechanical Design Guidelines A B C D E F G H 8 Figure 67. ATX Reference Clip - Sheet 2 Mechanical Drawings A B A B W 133.59 2.97 [ .117 ] R1.4 [ .055 ] X X 4X 0.4 [.015] 0.
Figure 68.
Thermal and Mechanical Design Guidelines Figure 69.
Figure 70.
Thermal and Mechanical Design Guidelines Figure 71.
NOTES: 1. FOR DETAILED SPECIFICATIONS SEE COMPONENT DRAWINGS. 2. THERMAL INTERFACE MATERIAL: 0.2CC (0.4 GRAMS) SHIN-ETSU-MICRO-S1 G751 THERMAL GREASE. 3. SEE SHEET 2 FOR ASSEMBLY RECOMMENDATIONS. 4. US PATENTS PENDING. ( 120 ) [ 4.7 ] 90 ) [ 3.543 ] ( 62.9 ) [ 2.476 ] ( 65.42 ) [ 2.576 ] ( ( 95 ) [ 3.740 ] Figure 72.
1 4 DETAIL SCALE ( 5.88 ) [ .232 ] 9.53 0.12 [ .375 .004 ] SECTION ( 9.53 ) [ .375 ] 6 B A-A SEE DETAIL Thermal and Mechanical Design Guidelines A A B 3 1 FAN ATTACH INSTALLATION: INSERT FAN ATTACH (1) INTO HEAT SINK (4) TO THE SPECIFIED DEPTH AND ORIENTATION. INSERT TOOL TO KEY TO TOP OF HEAT SINK FOR DEPTH ACCURACY. ARBOR PRESS OR SIMILAR TOOL IS REQUIRED. 2 FAN AND FAN WIRE INSTALLATION: A.
Figure 74.
Thermal and Mechanical Design Guidelines Figure 75.
Mechanical Drawings 122 Thermal and Mechanical Design Guidelines
Intel® Enabled Reference Solution Information Appendix G Intel® Enabled Reference Solution Information This appendix includes supplier information for Intel enabled vendors for RCFH-4 reference design, D60188-001 reference design and BTX reference design. The reference component designs are available for adoption by suppliers and heatsink integrators pending completion of appropriate licensing contracts. For more information on licensing, contact the Intel representative mentioned in Table 10. Table 10.
Intel® Enabled Reference Solution Information Table 12. D60188-001 Reference Thermal Solution Providers Supplier Part Description Supplier P/N Contact Phone Email Foxconn* Intel® D60188-001 Reference Solution 2ZR71-386 Wanchi Chen 408-919-6135 Wanchi.Chen@Foxconn .com Fujikura* Intel® D60188-001 Reference Solution FHP-7543 Rev A Yuji Yasuda 408-988-7478 yuji@fujikura.
