Technical Product Specification

Intel® Server System R1304BTSSFAN/ R1304BTLSFAN/ R1304BTLSHBN TPS Glossary
Glossary
This section contains important terms used in the preceding chapters. For ease of use, numeric
entries are listed first (for example, 82460GX) with alpha entries following (for example, AGP
4x). Acronyms are then entered in their respective place, with non-acronyms following.
Term
Definition
ACPI
Advanced Configuration and Power Interface
AP
Application Processor
APIC
Advanced Programmable Interrupt Control
ARP
Address Resolution Protocal
ASIC
Application Specific Integrated Circuit
ASMI
Advanced Server Management Interface
BIOS
Basic Input/Output System
BIST
Built-In Self Test
BMC
Baseboard Management Controller
Bridge
Circuitry connecting one computer bus to another, allowing an agent on one to access
the other
BSP
Bootstrap Processor
Byte
8-bit quantity
CBC
Chassis Bridge Controller (A microcontroller connected to one or more other CBCs,
together they bridge the IPMB buses of multiple chassis)
CEK
Common Enabling Kit
CHAP
Challenge Handshake Authentication Protocol
CMOS
Complementary Metal-oxide-semiconductor
In terms of this specification, this describes the PC-AT compatible region of battery-
backed 128 bytes of memory, which normally resides on the server board
DHCP
Dynamic Host Configuration Protocal
DPC
Direct Platform Control
EEPROM
Electrically Erasable Programmable Read-Only Memory
EHCI
Enhanced Host Controller Interface
EMI
Electromagnetic Interference
EMP
Emergency Management Port
EPS
External Product Specification
ESB2
Enterprise South Bridge 2
FBD
Fully Buffered DIMM
F MB
Flexible Mother Board
FRB
Fault Resilient Booting
FRU
Field Replaceable Unit
FSB
Front Side Bus
GB
1024 MB
GPA
Guest Physical Address
GPIO
General Purpose I/O
GTL
Gunning Transceiver Logic
HPA
Host Physical Address
HSC
Hot-swap Controller
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