Technical Product Specification

Intel® Server System R1304BTSSFAN/ R1304BTLSFAN/ R1304BTLSHBN TPS Product Overview
A
Rack handles (two)
F
System Memory DIMM slots
B
Server Board
G
Cooling Fans
C
PCIe Riser Assembly
H
Front Panel Board
D
Processor and Heatsink
I
Hard Drive Bays
E
Power supply
J
Slimline optical drive
Figure 4. Intel
®
Server System R1304BTLSHBN Major System Components
The I/O connector locations on the back of the system are pre-cut, so an I/O shield is not
required. The EMI gasket is pre-installed to maintain electromagnetic interference (EMI)
compliance levels. The layout arrangement is the same for both the fixed and hot-swap systems.
A
AC Power Connector
E
NIC 2 Connector (10/100/1000 Mb)
B
Serial Port A
F
PCI Express* Slot
C
Video Connector
G
USB Ports
D
NIC 1 Connector (10/100/1000 Mb)
H
USB Ports
Figure 5. Intel
®
Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN Back Panel Features
Revision 2.4
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