Datasheet

72 Dual-Core Intel
®
Itanium
®
Processor 9000 and 9100 Series Datasheet
Mechanical Specifications
4.2 Package Marking
The following section details the processor top-side and bottom-side markings for
engineering samples and production units. This is provided to aid in identification.
Specific details regarding individual fields in the product markings will be furnished in a
future release of this document.
4.2.1 Processor Top-Side Marking
The top-side mark is a laser marking on the IHS. Figure 4-7 shows the general location
of the processor top-side mark that provides the following information:
•Intel
®
• Itanium
®
Processor Family Legal Mark
• Assembly Process Order (APO) Number
•Unit Serial Number
•2D Matrix Mark
Tx Allowable torque at the package power
tab in X axis
0.57Nm max
T+y Allowable torque at the package power
tab in +y direction
1.24 Nm max Torque on the package edge in +Y
direction is determined by the load
applied in -Z and the distance from the
edge the package to the socket.
Torque on the package edge in -Y
direction is determined by the load
applied in +Z and the distance from
the edge the package to the heatsink
base.
To determine T+y, distance from the
edge the package to the socket of
55.7mm is applied
To determine T-y, distance from the
edge the package to the heatsink
pedestal of 42mm is applied
T-y
Allowable torque at the package power
tab in -y direction
0.93Nm
max
Notes:
1. Load determination done with 100-lb. load on the processor heatsink.
Table 4-3. Processor Package Load Limits at Power Tab (Sheet 2 of 2)
Parameter Description Value
1
Comments