Datasheet

Dual-Core Intel
®
Itanium
®
Processor 9000 and 9100 Series Datasheet 71
Mechanical Specifications
4.1.1 Voltage Regulator (MVR) to Processor Package Interface
Critical package mechanical requirements at its interface with the MVR are identified in
Figure 4-6 and Table 4-3. The processor interface boundary conditions with which MVR
must comply during and after installation are outlined in Table 4-3. These requirements
are intended to minimize potential damage to the processor that may result from
installation of the MVR.
Figure 4-6. Processor to MVR Interface Loads
90
Processor Heatsink
IHS
Processor Heatsink
90
T
Z
P
-z
P
+z
A
T
y
Substrate
Socket
Mother Board
Y
X
Z
X
Table 4-3. Processor Package Load Limits at Power Tab (Sheet 1 of 2)
Parameter Description Value
1
Comments
A Final position of the package at the
power tab (unloaded) with respect to
system board
3.8+/-
0.1mm
Position of the processor power tab is
based on the height of the mPGA700
ZIF socket height from the mother
post SMT
P Allowable load on the package in +z
and -z direction
22.25N max
d Allowable displacement at the
processor power tab in z direction
under load P
+/- 0.3 mm
max
Tz Allowable torque on the package tip in
z axis
0 Package loading in Y direction is not
allowed. Hence, zero torque in Z-axis