Datasheet

Dual-Core Intel
®
Itanium
®
Processor 9000 and 9100 Series Datasheet 3
Contents
1 Introduction...............................................................................................................11
1.1 Overview .........................................................................................................11
1.2 Processor Abstraction Layer................................................................................11
1.3 Mixing Processors of Different Frequencies and Cache Sizes ....................................12
1.4 Terminology .....................................................................................................12
1.5 State of Data....................................................................................................12
1.6 Reference Documents........................................................................................13
2 Electrical Specifications ...............................................................................................15
2.1 Dual-Core Intel
®
Itanium
®
Processor 9000 and 9100 Series System Bus..................15
2.1.1 System Bus Power Pins ........................................................................15
2.1.2 System Bus No Connect .......................................................................15
2.2 System Bus Signals...........................................................................................15
2.2.1 Signal Groups .....................................................................................15
2.2.2 Signal Descriptions ..............................................................................17
2.3 Package Specifications.......................................................................................18
2.4 Signal Specifications..........................................................................................18
2.4.1 Maximum Ratings................................................................................22
2.5 System Bus Signal Quality Specifications and Measurement Guidelines.....................23
2.5.1 Overshoot/Undershoot Magnitude..........................................................23
2.5.2 Overshoot/Undershoot Pulse Duration ....................................................24
2.5.3 Activity Factor.....................................................................................24
2.5.4 Reading Overshoot/Undershoot Specification Tables.................................24
2.5.5 Determining if a System Meets the Overshoot/Undershoot
Specifications......................................................................................25
2.5.6 Wired-OR Signals ................................................................................25
2.6 Voltage Regulator Connector Signals....................................................................27
2.7 System Bus Clock and Processor Clocking.............................................................31
2.8 Recommended Connections for Unused Pins..........................................................33
3 Pinout Specifications...................................................................................................35
4 Mechanical Specifications.............................................................................................65
4.1 Processor Package Dimensions............................................................................65
4.1.1 Voltage Regulator (MVR) to Processor Package Interface...........................71
4.2 Package Marking...............................................................................................72
4.2.1 Processor Top-Side Marking ..................................................................72
4.2.2 Processor Bottom-Side Marking.............................................................73
5 Thermal Specifications ................................................................................................75
5.1 Thermal Features..............................................................................................75
5.1.1 Thermal Alert......................................................................................75
5.1.2 Enhanced Thermal Management............................................................76
5.1.3 Power Trip..........................................................................................76
5.1.4 Thermal Trip.......................................................................................76
5.2 Case Temperature.............................................................................................76
6 System Management Feature Specifications...................................................................79
6.1 System Management Bus ...................................................................................79
6.1.1 System Management Bus Interface........................................................79
6.1.2 System Management Interface Signals...................................................79
6.1.3 SMBus Device Addressing.....................................................................81
6.2 Processor Information ROM ................................................................................82
6.3 Scratch EEPROM ...............................................................................................85