Datasheet

Ballout and Package Information
Intel
®
Quark™ microcontroller D2000
Datasheet January 2016
36 Document Number: 333577-002EN
The requirement for external component at PCB level is as shown in the table:
Component
Name
Description Characteristic Value Accuracy Unit
Cin Input
Capacitor
Ceramic 470 +/- 20% nF
Cout Output Tank
Capacitor
Ceramic 4.7 +/- 20% µF
L Switching
Inductor
47 +/- 30% µH
ESR rating for Cin and Cout:
For Cout: Resr(TYP) = 100mOhm / Resr(MAX) = 500mOhm
For Cin: Resr(TYP ) = 25mOhm / Resr(MAX) = 100mOhm
Please note for Cout, the higher ESR is, the higher the ripple is.
DCR rating for on-board inductor
L: DCR(TYP) = 100mOhm, DCR(MAX) = 500mOhm
The DCR impacts the efficiency of the regulator. The higher the DCR is, the lower the
efficiency is.
Also, the voltage drop across the DCR increases the min dropout the regulator can
support. For example, the minimum dropout specified in the spec is 200mV (Table 11)
by considering a 0.1 Ohm DCR. If the DCR is higher, the dropout will also be higher.
For example, DCR=0.5 Ohm = 0.1 + 0.5. For a 50 mA current, the dropout is 20 mV
higher (0.4 Ohm*50mA).
Table 5. Parasitic Requirement for Voltage Regulator Pins
Item Description
PVDD
Maximum total resistance (including wirebond, package pin
and board routing) between PVDD PIN and Input Supply
must be less than 400mΩ/nb PVDD pads.
VSENSE
Has to be star-connected: no current should flow through
this path between VSENSE pin and the regulated voltage
node. Access resistance to this port (including wirebond,
package pin and board routing) must be lower than 100Ω.