Datasheet

Dual-Core Intel® Xeon® Processor 7100 Series Datasheet 81
Thermal Specifications
obtained by reading the IA32_TEMPERATURE_TARGET MSR in the processor. The
T
CONTROL_OFFSET
value that is read from the IA32_TEMPERATURE_TARGET MSR (1A2H)
must be converted from Hexadecimal to Decimal and added to a T
CONTROL_BASE
value of
50°C for 150W TDP parts and added to a T
CONTROL_BASE
value of 40°C for 95W TDP
parts.
The Platform Id Bits located in the IA32_PLATFORM_ID MSR (17H) Bits[52:50] may be
used by the BIOS to determine the TDP of the processor. A 150W TDP part has a
Platform ID of ‘001’(Processor Flag 1) and a 95W TDP part has a Platform ID of ‘101’
(Processor Flag 5). Refer to the Cedar Mill Processor Family BIOS Writers Guide for
specific register details.
The value of T
CONTROL_OFFSET
may vary from 0x00h to 0x1Eh. Refer to the Cedar Mill
Processor Family BIOS Writers Guide for specific register details.
When Tdiode is above T
CONTROL
, then T
CASE
must be at or below T
CASE_MAX
as defined
by the thermal profile (see Figure 6-1 and Ta b le 6- 2 or Figure 6-2 and Tabl e 6 - 3).
Otherwise, the processor temperature can be maintained at T
CONTROL
.
6.2.8 Thermal Diode
The processor incorporates two on-die thermal diodes. A thermal sensor located on the
processor package monitors the die temperature of the processor for thermal
management/long term die temperature change purposes. The thermal diodes are
separate from the Thermal Monitor’s thermal sensor and cannot be used to predict the
behavior of the Thermal Monitor.
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