Datasheet

Dual-Core Intel® Xeon® Processor 7100 Series Datasheet 3
Contents
1Introduction............................................................................................................ 11
1.1 Terminology ..................................................................................................... 13
1.2 References ....................................................................................................... 14
1.3 State of Data .................................................................................................... 15
2 Electrical Specifications ........................................................................................... 17
2.1 Front Side Bus and GTLREF ................................................................................ 17
2.1.1 Front Side Bus Clock and Processor Clocking .............................................. 18
2.1.2 Front Side Bus Clock Select (BSEL[1:0]).................................................... 19
2.1.3 Phase Lock Loop (PLL) Power and Filter ..................................................... 20
2.2 Voltage Identification (VID) ................................................................................ 21
2.3 Cache Voltage Identification (CVID) ..................................................................... 22
2.4 Reserved, Unused, and TESTHI Pins..................................................................... 23
2.5 Mixing Processors.............................................................................................. 24
2.6 Front Side Bus Signal Groups.............................................................................. 24
2.7 GTL+ Asynchronous and AGTL+ Asynchronous Signals ........................................... 26
2.8 Test Access Port (TAP) Connection....................................................................... 27
2.9 Maximum Ratings.............................................................................................. 27
2.10 Processor DC Specifications ................................................................................ 28
2.10.1 Flexible Motherboard (FMB) Guidelines ...................................................... 28
2.10.2 VCC Overshoot Specification .................................................................... 34
2.10.3 VCACHE Overshoot Specification .............................................................. 35
2.10.4 Die Voltage Validation............................................................................. 36
2.10.5 Clock, Miscellaneous and AGTL+ Specifications........................................... 36
2.11 AGTL+ Front Side Bus Specifications.................................................................... 40
3 Mechanical Specifications ........................................................................................ 41
3.1 Package Mechanical Drawing............................................................................... 42
3.2 Processor Component Keep-Out Zones................................................................. 45
3.3 Package Loading Specifications ........................................................................... 45
3.4 Package Handling Guidelines............................................................................... 46
3.5 Package Insertion Specifications.......................................................................... 46
3.6 Processor Mass Specifications ............................................................................. 46
3.7 Processor Materials............................................................................................ 46
3.8 Processor Markings............................................................................................ 46
3.9 Processor Pin-Out Coordinates ............................................................................ 48
4 Pin Listing ............................................................................................................... 49
4.1 Dual-Core Intel® Xeon® Processor 7100 Series Pin Assignments ............................ 49
4.1.1 Pin Listing by Pin Name........................................................................... 49
4.1.2 Pin Listing by Pin Number........................................................................ 57
5 Signal Definitions .................................................................................................... 65
5.1 Signal Definitions .............................................................................................. 65
6 Thermal Specifications ............................................................................................ 73
6.1 Package Thermal Specifications........................................................................... 73
6.1.1 Thermal Specifications ............................................................................ 73
6.1.2 Thermal Metrology ................................................................................. 77
6.2 Processor Thermal Features................................................................................ 77
6.2.1 Thermal Monitor..................................................................................... 77
6.2.2 Thermal Monitor 2 .................................................................................. 78
6.2.3 On-Demand Mode .................................................................................. 79
6.2.4 PROCHOT# Signal Pin ............................................................................. 80
6.2.5 FORCEPR# Signal Pin.............................................................................. 80