Datasheet

Mobile Intel
®
Celeron
®
Processor (0.18µ) in BGA2 and Micro-PGA2 Packages
283654-003 Datasheet 49
Table 28. Socketable Micro-PGA2 Package Specification
Symbol Parameter Min Max Unit
A Overall Height, top of die to seating plane of interposer 3.13 3.73 mm
A
1
Pin Length 1.25 REF mm
A
2
Die Height 0.854 REF mm
B Pin Diameter 0.30 REF mm
D
2
Package Width 28.27 REF mm
D Die Substrate Width 27.05 27.35 mm
D
1
Die Width
D0 Step 8.82 REF (CPUID = 068Ah)
C0 Step 8.82 REF (CPUID = 0686h)
B0 Step 9.28 REF (CPUID = 0683h)
A2 Step 9.37 REF (CPUID = 0681h)
mm
E
2
Package Length 34.21 REF mm
E Die Substrate Length 30.85 31.15 mm
E
1
Die Length
D0 Step 11.00 REF (CPUID = 068Ah)
C0 Step 10.80 REF (CPUID = 0686h)
B0 Step 11.23 REF (CPUID = 0683h)
A2 Step 11.27 REF (CPUID = 0681h)
mm
e Pin Pitch 1.27 mm
— Pin Tip Radial True Position
≤ 0.127 REF
mm
N Pin Count 495 each
S
1
Outer Pin Center to Short Edge of Substrate 2.144 REF mm
S
2
Outer Pin Center to Long Edge of Substrate 1.206 REF mm
P
DIE
Allowable Pressure on the Die for Thermal Solution — 689 kPa
W Package Weight 6.2 REF grams