Datasheet

Contents

1 Product Description

1.1 Overview.......................................................................................... 9

1.1.1 Feature Summary .................................................................. 9

1.1.2 Board Layout ....................................................................... 11

1.1.3 Block Diagram ..................................................................... 13

1.2 Online Support................................................................................ 14

1.3 Processor ....................................................................................... 14

1.3.1 Intel D410 Graphics Subsystem.............................................. 15

1.4 System Memory .............................................................................. 16

1.5 Intel

NM10 Express Chipset............................................................. 17

1.5.2 USB ................................................................................... 18

1.5.3 SATA Support ...................................................................... 18

1.6 Real-Time Clock Subsystem .............................................................. 19

1.7 Legacy I/O Controller....................................................................... 19

1.8 LAN Subsystem............................................................................... 20

1.8.1 LAN Subsystem Drivers......................................................... 20

1.8.2 RJ-45 LAN Connector with Integrated LEDs .............................. 21

1.9 Audio Subsystem............................................................................. 22

1.9.1 Audio Subsystem Software .................................................... 23

1.9.2 Audio Connectors and Headers ............................................... 23

1.10 Hardware Management Subsystem .................................................... 24

1.10.1 Hardware Monitoring............................................................. 24

1.10.2 Thermal Monitoring .............................................................. 25

1.11 Power Management ......................................................................... 26

1.11.1 ACPI................................................................................... 26

1.11.2 Hardware Support ................................................................ 29

1.11.3 ENERGY STAR*, E-Standby, and ErP Compliance ...................... 32

2 Technical Reference

2.1 Memory Map................................................................................... 33

2.1.1 Addressable Memory............................................................. 33

2.2 Connectors and Headers................................................................... 36

2.2.1 Back Panel .......................................................................... 37

2.2.2 Component-side Connectors and Headers ................................ 39

2.3 BIOS Configuration Jumper Block....................................................... 47

2.4 Mechanical Considerations ................................................................ 49

2.4.1 Form Factor......................................................................... 49

2.5 Electrical Considerations................................................................... 50

2.5.1 Fan Header Current Capability................................................ 50

2.5.2 Add-in Board Considerations .................................................. 50

2.6 Thermal Considerations.................................................................... 50

2.6.1 Passive Heatsink Design in a Passive System Environment ......... 52

2.7 Power Consumption ......................................................................... 55