Guidelines

Reference Thermal Solutions
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26 Intel
®
E7500 MCH Thermal and Mechanical Design Guidelines
6.3.2 Extruded Heatsink Profiles
The E7500 chipset reference thermal solution uses an extruded heatsink for cooling the MCH.
Figure 13 shows the heatsink profile. This document does not provide tolerance information.
Check with your heatsink supplier for specific tolerances. Appendix A lists suppliers for the
extruded heatsink. Other heatsinks with similar dimensions and increased thermal performance
may be available, including the tall heatsink shown in Figure 14. Contact your heatsink supplier
for information on alternate heatsinks.
Figure 13. Extruded Heatsink Profile
3.05 mm (0.120 in.)
42.34 mm (1.67 in.)
23.01 mm (0.906 in.)
Extr_Heasink_Profile
NOTE: Not to scale.
Figure 14. Alternate Tall Heatsink Profile
3.81 mm (0.150 in.)
42.34 mm (1.67 in.)
35.00 mm (1.38 in.)
Alt_Extr_Heatsink_Profile
NOTE: Not to scale.