Guidelines

4 Intel
®
7500 Chipset Thermal Mechanical Design Guide
Figures
1-1 Thermal Design Process....................................................................................... 7
2-1 IOH Package Dimensions (Top View) ..................................................................... 9
2-2 IOH Package Dimensions (Bottom View) ...............................................................10
2-3 IOH Package Drawing.........................................................................................11
2-4 Non-Critical to Function Solder Joints ...................................................................12
5-1 Thermal Solution Decision Flowchart ....................................................................20
5-2 Zero Degree Angle Attach Heatsink Modifications ...................................................20
5-3 Zero Degree Angle Attach Methodology (Top View) ................................................21
6-1 Tall Torsional Clip Heatsink Measured Thermal Performance versus
Approach Velocity..............................................................................................24
6-2 Tall Torsional Clip Heatsink Volumetric Envelope for the IOH....................................25
6-3 Tall Torsional Clip Heatsink Board Component Keepout ...........................................26
6-4 Retention Mechanism Component Keepout Zone ....................................................27
6-5 Tall Torsional Clip Heatsink Assembly ...................................................................28
6-6 Tall Torsional Clip Heatsink Extrusion Profile..........................................................30
6-7 Anchors for Intel 7500 Chipset Tall and Short Heatsink Retention.............................31
7-1 Short Torsional Clip Heatsink Measured Thermal Performance versus
Approach Velocity..............................................................................................34
7-2 Short Torsional Clip Heatsink Volumetric Envelope for the IOH.................................35
7-3 Short Torsional Clip Heatsink Board Component Keepout ........................................36
7-4 Retention Mechanism Component Keepout Zones...................................................37
7-5 Short Torsional Clip Heatsink Assembly.................................................................37
7-6 Short Torsional Clip Heatsink Extrusion Profile .......................................................38
8-1 Example of Thick Traces used in a Desktop BGA.....................................................42
B-1 Intel® 7500 chipset Package Drawing ..................................................................50
B-2 Tall Torsional Clip Heatsink Assembly Drawing.......................................................51
B-3 Tall Torsional Heatsink Drawing ...........................................................................52
B-4 Tall Heatsink Drawing.........................................................................................53
B-5 Tall Torsional Clip Drawing..................................................................................54
B-6 Tall Heatsink Keepouts .......................................................................................55
B-7 Short Torsional Clip Heatsink Assembly Drawing ....................................................56
B-8 Short Torsional Heatsink Drawing ........................................................................57
B-9 Short Torsional Clip Drawing ...............................................................................58
B-10 Short Heatsink Keepouts ....................................................................................59