Guide

Thermal and Mechanical Design
34 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
2.1.5.2.1 ILM Features
• Eliminates the motherboard thickness dependency from the stack-up because the
heatsink attach points are located on the top side of the board.
• Nuts clamp the ILM frame to the board, providing good clamping and hence
reduced board bending leading to more solder joint reliability.
• Socket keying ensures ILM is used with an intended socket, in this case LGA2011-1
socket.
• Dual lever helps in reducing the lever actuation force and enables applying
uniformly distributed load onto the socket.
• Raised taps prevents levers from pulling out at the hinge locations.
• ILM interlocking enforces the levers opening and closing sequence.
Socket protrusion and ILM keying features prevent 180-degree rotation of ILM
assembly with respect to socket, see Figure 2-18. This result in a specific orientation
with respect to ILM lever.
Figure 2-17. ILM Attachment Holes