Guide

Thermal and Mechanical Design
24 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
•Base Material
High-strength copper alloy.
• Contact Area Plating
For the area on socket contacts where processor lands will mate, there is a 0.381 μm
[15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel under-
plating in critical contact areas (area on socket contacts where processor lands will
mate) is required. No contamination by solder in the contact area is allowed during
solder reflow.
• Lubricants
For the final assembled product, no lubricant is permitted on the socket contacts. If
lubricants are used elsewhere within the socket assembly, these lubricants must not be
able to migrate to the socket contacts.
•Co-Planarity
The co-planarity (profile) requirement for all contacts mating to the top side of the
socket is defined in Appendix F.
• True Position
The contact pattern has a true position requirement with respect to applicable datum in
order to mate with the package land pattern. Refer to Appendix F for more details.
Figure 2-9. Contact Orientation