Guide
Mechanical Drawings
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 101
Thermal/ Mechanical Specifications and Design Guide
Figure G-10. Processor 4U Heatsink Assembly Drawing - G48321 Rev 1
13
4
5678
B
C
D
A
123
4
5678
B
C
D
A
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
35±2
35±2
0.25
G48321 1 1
DWG. NO SHT. REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 1:1
1G48321D
REV
DRAWING NUMBER
SIZE
H-SINK ASSY, BRICKLAND TOWER W/TIM
TITLE
PTMI
DEPARTMENT
SEE NOTESSEE NOTES
FINISHMATERIAL
--
DATEAPPROVED BY
--
--
DATECHECKED BY
10-14-11T. BOYD
DATEDRAWN BY
10-14-11T. BOYD
DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MM
TOLERANCES AS SPECIFIED
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTIONPART NUMBER
ITEM NO
QTY
TOP ASSEMBLYG48321TOP
BRICKLAND-EX TOWER HSG20942-00111
PMC45F 35MM X 35MM X 0.25MMC65471_PCM45F_35X3521
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPR
- 1 PRELIMINARY RELEASE FOR REVIEW 11/14/11 TAB
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
NOTES UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES
UL 94 - UL FLAMABILITY TESTING
99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
07-070-SHS - ADDENDUM FOR SOLDER ON HEATSINKS
2. 3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL. DIMENSIONS CALLED OUT ON THE
DRAWING SHALL CONFORM TO THE DEFAULT TOLERANCE BLOCK UNLESS OTHERISE
SPECIFIED. THE 3D MODEL SHALL CONTROL ALL FEATURES OF THIS PART NOT DEFINED
ON THE DRAWING. MODEL TO BE INTERPRETED USING DATUM A (PRIMARY), DATUM B
(SECONDARY), AND DATUM C (TERTIARY) PER THE DRAWING CALLOUT.
3. FOR HEATSINK DETAILS, REFER TO INTEL DOCUMENT G20942
4 MARK PART NUMBER AND DATE CODE ON INDICATED SURFACE.
5. APPLY ITEM 2 CENTERED ON THE HEATSINK INTERFACE SURFACE PER THE MATERIAL
MANUFACTURERS APPLICATION PROCEDURES.
1
2
TIM 2
SCALE 2:1
4
H-Sink Assy, Intel® Xeon®
Processor E7 V2 Product Family-
based Platform Tower w/TIM