Guide
Mechanical Drawings
92 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
Figure G-1. PCB Primary Side Keep-out Zone for LGA2011-1 Socket - G26770 Rev 2
13
4
5678
B
C
D
A
123
4
5678
B
C
D
A
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
1.811
[46]
2.724
[69.2]
ROUTE KEEPOUT.276
7.01[]
NPTH.150
3.8[]
COPPER WEAR PAD: NON-GROUNDED
SOLDER MASKED 0.0" HEIGHT PACKAGE KEEPOUT
.256
6.5[]
THROUGH ALL ROUTE KEEPOUT.180
4.56[]
.717
[18.2]
.504
[12.8]
.906
[23]
1.362
[34.6]
KOZ_G26770_SKT-R1-MTG-HOLES 1 2
DWG. NO SHT. REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 2:1
2KOZ_G26770_SKT-R1-MTG-HOLESD
REV
DRAWING NUMBER
SIZE
KOZ,SKT-R1 ILM, MTG HOLES
TITLE
PTMI
DEPARTMENT
SEE NOTESSEE NOTES
FINISHMATERIAL
--
DATEAPPROVED BY
--
--
DATECHECKED BY
2-2-11T. BOYD
DATEDRAWN BY
2-2-11T. BOYD
DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN INCHES (MM)
TOLERANCES:
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTIONPART NUMBER
ITEM NO
QTY
-KOZ_G26770_SKT-R1-MTG-HOLESTOP
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPR
- A DRAFT 2-9-11 TAB
1 INITIAL RELEASE 8/9/11 TAB
A5 2 CHANGE THRU ALL ROUTE KEEPOUT DIM TO MATCH R0 AND PRELIM SYMBOL 9/28/11 TAB
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
NOTES:
1. THIS DRAWING TO BE USED IN CORELATION WITH SUPPLIED 3D DATA BASE FILE. ALL DIMENSIONS AND
TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
2. MAXIMUM OUTLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE ILM HOLE PATTERN FOR PROPER
ILM AND SOCKET FUNCTION.
3 A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON THE
SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN THE HEIGHT
DEFINED BY THAT ZONE AFTER REFLOW.
ALL ZONES DEFINED WITHIN THE 93 X 93 MM OUTLINE REPRESENT SPACE THAT RESIDES BENEATH
THE HEATSINK FOOTPRINT.
UNLESS OTHERWISE NOTED ALL VIEW DIMENSION ARE NOMINAL. ALL HEIGHT RESTRICTIONS ARE
MAXIMUMS. NEITHER ARE DRIVEN BY IMPLIED TOLERANCES.
A HEIGHT RESTRICTION OF 0.0 MM REPRESENTS THE TOP (OR BOTTOM) SURFACE OF THE MOTHERBOARD
AS THE MAXIMUM HEIGHT. THIS IS A NO COMPONENT PLACEMENT ZONE INCLUDING SOLDER BUMPS.
SEE NOTE 4 FOR ADDITIONAL DETAILS.
4 ASSUMING A GENERIC A MAXIMUM COMPONENT HEIGHT ZONE.
CHOICE OF AND COMPONENT PLACEMENT IN THIS ZONE MUST INCLUDE:
- COMPONENT NOMINAL HEIGHT
- COMPONENT TOLERANCES
- COMPONENT PLACEMENT TILT
- SOLDER REFLOW THICKNESS
DO NOT PLACE COMPONENTS IN THIS ZONE THAT WILL EXCEED THIS MAXIMUM COMPONENT HEIGHT.
5 ASSUMES PLACEMENT OF A 0805 CAPACITOR WITH DIMENSIONS:
- CAP NOMINAL HEIGHT = 1.25MM (0.049")
- COMPONENT MAX MATERIAL CONDITION HEIGHT NOT TO EXCEED 1.50MM.
SEE DETAIL A
SOCKET OUTLINE
FOR REFERENCE ONLY
3:1SCALE
10:14 PLACES SCALE
ATOP SIDE HOLE DETAIL
LEGEND
ZONE 1:
0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT,
NO ROUTE ZONE
ZONE 2:
1.67 MM MAX COMPONENT HEIGHT AFTER REFLOW 3 4
1.50 MM MAX (MMC) COMPONENT HEIGHT BEFORE REFLOW 3 5
ZONE 3:
NO ROUTE ZONE THROUGH ALL LAYERS