Guide

Quality and Reliability Requirements
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 69
Thermal/ Mechanical Specifications and Design Guide
B Quality and Reliability
Requirements
B.1 Thermal/Mechanical Solution Stress Test
Design, including materials, shall be consistent with the manufacture of units that meet
the following environmental reference points.
The reliability targets in this section are based on the expected field use environment
for a server product. The test sequence for the components will be developed using the
knowledge-based reliability evaluation methodology, which is acceleration factor
dependent. A simplified process flow of this methodology can be seen in Figure B-1.
The stress tests described in Table B-1 can be used as guidelines in setting a
mechanical reliability test suite towards validation.
Figure B-1. Flow Chart of Knowledge-Based Reliability Evaluation Methodology
Establish the
market/expected use
environment for the
technology
Develop Speculative stress
conditions based on
historical data, content
experts, and literature
search.
Freeze stressing
requirements and perform
additional data turns.
Perform stressing to
validate accelerated
stressing assumptions and
determine acceleration
factors.