Guidelines

Intel
®
7500 Chipset Thermal Mechanical Design Guide 5
Tables
2-1 Solder Ball Composition on Intel® 7500 chipset ......................................................9
2-2 Pre-Load Requirements......................................................................................13
3-1 Intel® 7500 Chipset Thermal Design Power ..........................................................15
3-2 Intel 7500 Chipset Thermal Specification and Tcontrol............................................ 15
6-1 Intel
®
Xeon
®
Processor 7500 Series-based Platform and
Intel
®
Itanium
®
Processor 9300 Series Platform Operating Conditions...................... 23
6-2 Honeywell PCM45 F* TIM Performance as a Function of Attach Pressure ................... 29
6-3 Target load for Intel 7500 Chipset Heatsink Spring Clip Design................................ 29
6-4 Anchor Bend Angle and Maximum Pullout force as a Function of Board Thickness....... 31
6-5 Reliability Guidelines.......................................................................................... 31
7-1 Short Heatsink Design Thermal Boundary Conditions.............................................. 33
7-2 Honeywell PCM45 F* TIM Performance as a Function of Attach Pressure ................... 39
7-3 Reliability Guidelines.......................................................................................... 39
8-1 Shock Strain Guidance....................................................................................... 43
B-1 Mechanical Drawing List ..................................................................................... 49