Datasheet

Dual-Core Intel
®
Xeon
®
Processor 7000 Series Datasheet 33
3 Mechanical Specifications
The Dual-Core Intel Xeon processor 7000 series is packaged in a FC-mPGA4 package that
interfaces with the motherboard via a mPGA604 socket. The package consists of a processor core
mounted on a substrate pin-carrier. An IHS is attached to the package substrate and core and serves
as the mating surface for processor component thermal solutions, such as a heatsink. Figure 3-1
shows a sketch of the processor package components and how they are assembled together. Refer
to the mPGA604 Socket Design Guidelines for complete details on the mPGA604 socket.
The package components shown in Figure 3-1 include the following:
1. IHS
2. Processor die
3. FC-mPGA4 package
4. Pin-side capacitors
5. Package pin
Note: Figure 3-1 is not to scale and is for reference only. The mPGA604 socket is not shown.
3.1 Package Mechanical Drawing
The package mechanical drawings are shown in Figure 3-2 and Figure 3-3. The drawings include
dimensions necessary to design a thermal solution for the processor. These dimensions include:
1. Package reference with tolerances (total height, length, width, etc.)
2. IHS parallelism and tilt
3. Pin dimensions
4. Top-side and back-side component keepout dimensions
5. Reference datums
All drawing dimension are in mm [in].
Figure 3-1. Processor Package Assembly Sketch