Guide

4 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
E LGA2011-1 Socket Electrical ....................................................................................81
E.1 Socket Electrical Requirements............................................................................81
E.2 S-Parameters....................................................................................................82
E.3 Dielectric Withstand Voltage................................................................................83
E.4 Insulation Resistance .........................................................................................83
E.5 Contact Current Rating.......................................................................................83
F Socket Mechanical Drawings....................................................................................85
G Mechanical Drawings ...............................................................................................91
Figures
1-1 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family-based
Platform Socket Stack............................................................................................10
2-1 Processor Package Assembly Sketch........................................................................13
2-2 Processor Package ISO View...................................................................................14
2-3 Processor Package Top and Bottom View..................................................................14
2-4 Processor Top-Side Markings ..................................................................................16
2-5 LGA2011-1 Socket with Cover.................................................................................17
2-6 Hexagonal Array in LGA2011-1 ...............................................................................18
2-7 LGA2011-1 Socket Features ...................................................................................19
2-8 Socket Pick and Place Cover ...................................................................................20
2-9 Contact Orientation ...............................................................................................24
2-10 Offset between LGA Land Center and Solder Ball Center.............................................25
2-11 Contact Wiping Direction........................................................................................26
2-12 Contact Force versus Contact Deflection Range .........................................................26
2-13 LGA2011 Socket NCTF Solder Joints (Bottom View) ...................................................28
2-14 ILM Assembly (Closed Orientation) ..........................................................................31
2-15 ILM Assembly (Open Orientation)............................................................................32
2-16 ILM as a Universal Retention Mechanism ..................................................................33
2-17 ILM Attachment Holes............................................................................................34
2-18 ILM Keying...........................................................................................................35
2-19 Back Plate Assembly..............................................................................................36
2-20 ILM Cover ............................................................................................................37
2-21 Preventing Hinge Lever from Latching First...............................................................37
2-22 ILM Lever Closing Sequence ...................................................................................38
2-23 Opening Sequence ................................................................................................39
2-24 Processor Package Thermocouple Location................................................................42
2-25 Socket Temperature Measurement Location..............................................................46
2-26 TCONTROL and Fan Speed Control ..........................................................................48
2-27 Processor Thermal Characterization Parameter Relationships.......................................51
2-28 Suggested Board Marking.......................................................................................56
2-29 LGA2011-1 Socket Land Pattern (Top View of Board) .................................................57
2-30 Processor Reference Heatsink Isometric View............................................................60
2-31 Tower Heatsink Performance Curves for 130W ..........................................................61
A-1 Processor and Enabling Components Mechanical Assembly..........................................64
A-2 ILM Installation onto Baseboard ..............................................................................65
A-3 Socket Pick and Place Cover Removal ......................................................................66
A-4 Processor Installation Sequence..............................................................................67
A-5 Processor in Installed Position.................................................................................67
A-6 Heatsink Installation..............................................................................................68
B-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology..............................69
D-1 Processor Package Mechanical Drawing (Sheet 1 of 3)................................................78
D-2 Processor Package Mechanical Drawing (Sheet 2 of 3)................................................79