Datasheet

Datasheet 313
Ballout and Package Information
12.2 Package Information
The MCH is available in a 40 mm [1.57 in] x 40 mm [1.57 in] Flip Chip Ball Grid Array
(FC-BGA) package with an integrated heat spreader (IHS) and 1300 solder balls.
Figure 15 shows the package dimensions.
Figure 15. MCH Package Drawing