Guidelines

Thermal Metrology
20 Intel
®
7500 Chipset Thermal Mechanical Design Guide
NOTE: Not to scale.
Figure 5-1. Thermal Solution Decision Flowchart
Figure 5-2. Zero Degree Angle Attach Heatsink Modifications
Attach
thermocouples
using recommended
metrology. Setup
the system in the
desired
configuration.
Tdie >
Specification?
No
Yes
Heatsink
Required
Select
Heatsink
End
Start
Run the Power
program and
monitor the
device die
temperature.
Attach device
to board
using normal
reflow
process.