Guide

R
4 Intel
®
E7500/E7501/E7505 Chipset MCH Thermal Design Guide
Figures
Figure 1. Thermal Design Process...................................................................................... 8
Figure 2. MCH Package Dimensions (Side View)............................................................. 11
Figure 3. MCH Package Dimensions (Top View).............................................................. 12
Figure 4. 0° Angle Attach Methodology (Top View) ..........................................................18
Figure 5. 0° Angle Attach Heatsink Modifications ............................................................. 18
Figure 6. Thermal Solution Decision Flowchart ................................................................ 19
Figure 7. Reference Heatsink Volumetric Envelope for the MCH..................................... 22
Figure 8. Reference Thermal Solution Assembly..............................................................23
Figure 9. Reference Thermal Solution Assembly (Side View) ..........................................24
Figure 10. Reference Thermal Solution (Top View).......................................................... 24
Figure 11. Preferred Heatsink Orientation ........................................................................25
Figure 12. Extruded Heatsink Profile ................................................................................26
Figure 13. Alternate Tall Heatsink Profile..........................................................................26
Figure 14. Heatsink Mechanical Gasket, Optional Two-Piece.......................................... 27
Figure 15. Heatsink Retention Mechanism Layout............................................................ 28
Figure 16. Retention Mechanism Component Keep-Out Zones ....................................... 29
Figure 17. MCH Heatsink Assembly ................................................................................. 34
Figure 18. MCH Heatsink Clip........................................................................................... 35
Tables
Table 1. Intel
®
E7500 Chipset MCH Thermal Specifications ............................................ 15
Table 2. Intel
®
E7501 Chipset MCH Thermal Specifications ............................................ 15
Table 3. Intel
®
E7505 Chipset MCH Thermal Specifications ............................................ 15
Table 4. Reliability Guidelines ........................................................................................... 30
Table 5. Complete Thermal Solution Kits.......................................................................... 31
Table 6. Extruded Heatsinks ............................................................................................. 31
Table 7. Interface Materials...............................................................................................32
Table 8. Attach Hardware.................................................................................................. 32