Vol 1

Intel® Xeon® Processor E7-8800/4800/2800 v2 Product Family 17
Datasheet Volume One, February 2014
Overview
1.3 Power Management Support
1.3.1 Processor Package and Core States
• ACPI C-states as implemented by the following processor C-states:
— Package: PC0, PC1/PC1E, PC3, PC6
— Core: CC0, CC1/CC1E, CC3, CC6
• Enhanced Intel SpeedStep Technology
1.3.2 System States Support
• S0, S1(transitional only),S4, S5
1.3.3 Memory Controller
• Memory thermal monitoring via MEM_HOT_C01_N and MEM_HOT_C23_N pins
1.3.4 PCI Express*
• L0s and L1 low power states
1.3.5 Intel® QPI
• L0s, L0p, and L1 power management capabilities
1.4 Thermal Management Support
• Digital Thermal Sensor with multiple on-die temperature zones
• Adaptive Thermal Monitor
• THERMTRIP_N and PROCHOT_N signal support
• On-Demand mode clock modulation
• Closed Loop Thermal Throttling
• Fan speed control with DTS
• Two integrated SMBus masters for accessing thermal data from DIMMs
• New Memory Thermal Throttling features via MEM_HOT_C{01/23}_N pins
• Running Average Power Limit (RAPL), Processor and DRAM Thermal and Power
Optimization Capabilities
1.5 Package Summary
The Intel® Xeon® E7 v2 processor socket type is noted as Socket R1. It is a 52.5 x 45
mm FCLGA package (LGA2011-1).