Hub Datasheet

Ballout and Package Information
204 Intel
®
E7505 Chipset MCH Datasheet
7.2 Package Specifications
The MCH package is a 42.5 mm x 42.5 mm FCBGA with 1005 LANDS. Figure 7-4 and Figure 7-5
show the package dimensions for the MCH. For more detailed package information, refer to the
Intel
®
E7500/E7505 Chipset Thermal Design Guide.
NOTE:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M-1982.
Figure 7-4. Package Dimensions (Bottom View)
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
101620
3579
111315
19
4618 81214
22
21
24
23
26
25
28
27
30
29
31
32
(n)x 0.025 Min
Metal Edge
(n)x ∅ 0.790 ± 0.025
Solder Resist Opening
(n)x 0.650 ± 0.040
Detail A
∅
∅∅
∅ 00.071 L C
∅
∅∅
∅ 00.200 L C A S B
33
1
2
1.270
20.320
40.640
2x 42.500 ±0.100
0.200 A B
1.270
21.250
Detail A
17