Guide

Thermal and Mechanical Design
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 21
Thermal/ Mechanical Specifications and Design Guide
2.1.2.3.8 Durability
The socket must withstand 30 cycles of processor insertion and removal. The maximum
part average and single pin resistances from Table E-1 must be met when mated in the
1st and 30th cycles.
2.1.2.3.9 Socket Keep-in/Keep-out Zone
Socket keep-in and keep-out zones are identified on the motherboard to ensure that
sufficient space is available for the socket, and to prevent interference between the
socket and the components on the motherboard. These areas are illustrated in
Appendix G. It is the responsibility of the socket supplier and the customer to identify
any required deviation from specifications identified here.
2.1.2.3.10 Attachment
The socket will be attached to the motherboard via its 2011 contact solder balls. There
are no additional external methods (that is, screw, extra solder, adhesive, and so on) to
attach the socket.
The socket will be tested against the mechanical shock and vibration requirements such
as listed in Appendix B under the expected use conditions with all assembly
components under the loading conditions outlined in Section 2.1.2.3.11.
2.1.2.3.11 Socket Loading and Deflection Specifications
Table 2-5 provides loading and board deflection specifications for the LGA2011-1
Socket. These mechanical load limits should not be exceeded during component
assembly, mechanical stress testing, or standard drop and shipping conditions. All
dynamic requirements are under room temperature conditions while all static
requirements are under 125°C conditions.
Notes:
1. Socket load specification is for throughout the product life cycle.
2. The compressive load applied on the LGA contacts to meet electrical performance.
3. The total load applied by both the ILM and the heatsink onto the socket through the processor package.
4. Maximum allowable strain below socket BGA corners during transient loading events (i.e., slow
displacement events) which might occur during board manufacturing, assembly or testing. See the
LGA2011-1 BFI Strain Guidance Sheet. Contact your Intel CQE representative on how to obtain a copy of
this datasheet.
5. Dynamic compressive load applies to all board thicknesses.
6. Dynamic loading is defined as an 11ms duration average load superimposed on the static load requirement.
This load is superimposed onto the socket static compressive load to obtain total dynamic load.
The minimum Static Total Compressive load will ensure socket reliability over the life of
the product and that the contact resistance between the processor and the socket
contacts meets the values outlined in Table E-1.
Table 2-5. Socket Loading and Deflection Specifications
Parameter
SI Units
Notes
Min Max Unit
Static Compressive per Contact 10 38 gf 1, 2
Static Compressive Load 490 1068 N 2, 3
Dynamic Compressive Load 589 N 5, 6
Board Transient Strain 93 and 130 mil board 450 ue 4