Guidelines

Thermal Mechanical Design
12 Dual-Core Intel
®
Xeon
®
Processor 7000 Sequence Thermal /Mechanical Guidelines
2.1.2 Mechanical Dimensions
The Dual-Core Intel Xeon processor 7000 sequence is packaged using the flip-chip micro pin grid
array (FC-mPGA4) package technology. Please refer to the Dual-Core Intel® Xeon® Processor
7000 Sequence Datasheet for detailed mechanical specifications. The Dual-Core Intel Xeon
processor 7000 sequence mechanical drawings, Figure 2-1 and Figure 2-2, provide the mechanical
information for Dual-Core Intel Xeon processor 7000 sequences. The drawing is superseded with
the drawing in the processor Datasheet, should there be any conflicts.
Figure 2-1. Dual-Core Intel® Xeon® Processor 7000 Sequence Mechanical Drawing, Sheet 1