Guidelines

Intel
®
7500 Chipset Thermal Mechanical Design Guide 31
Reference Thermal Solution
6.6 Reliability Guidelines
Each motherboard, heatsink and attach combination may vary the mechanical loading
to the component. Based on the end user environment, the user should define the
appropriate reliability test criteria and carefully evaluate the completed assembly prior
to use in high volume. The reference solution is to be mounted to a fully configured
system. The environmental reliability requirements for the reference thermal solution
are shown in Table 6-5 These could be considered as general guidelines.
Notes:
1. It is recommended that the above tests be performed on a sample size of at least twelve assemblies from
three lots of material.
2. Additional inspection guidelines may be added at the discretion of the user.
§
Figure 6-7. Anchors for Intel 7500 Chipset Tall and Short Heatsink Retention
Table 6-4. Anchor Bend Angle and Maximum Pullout force as a Function of Board
Thickness
Intel Part
Number
Foxconn Part
Number
MB thickness
(Inches)
Anchor bend
angle (degrees)
Max THM pullout force
for each anchor
A13494-008
HB9703E-DW 0.062 45 10lbf
HB9703E-M3W 0.085 45 10lbf
Wave Soldering
Junctions
Anchors forces
contacting points
Anchors pins
Wave Soldering
Junctions
Anchors forces
contacting points
Anchors pins
Table 6-5. Reliability Guidelines
Test
[1]
Objective Inspection Guidelines
[2]
Mechanical Shock
System level unpackaged
Profile: 25G
2 drops in all 6 orientations
Visual Check and Electrical Functional Test
Random Vibration
System level unpackaged
Duration: 10 min/axis, 3 axes
Power Spectral Density Profile: 2.20g RMS
Visual Check and Electrical Functional Test
Thermal Cycling -40°C to 85°C, in conformance to JEDEC Visual Check and Electrical Functional Test