Guide

R
Intel
®
E7500/E7501/E7505 Chipset MCH Thermal Design Guide 3
Contents
1 Introduction..........................................................................................................................7
1.1 Design Flow............................................................................................................ 8
1.2 Definition of Terms ................................................................................................. 9
1.3 Reference Documents.......................................................................................... 10
2 Packaging Technology...................................................................................................... 11
3 Thermal Simulation ...........................................................................................................13
4 Thermal Specifications......................................................................................................15
4.1 Case Temperature and Thermal Design Power................................................... 15
4.2 Die Temperature................................................................................................... 15
5 Thermal Metrology ............................................................................................................ 17
5.1 Die Temperature Measurements.......................................................................... 17
5.1.1 0° Angle Attach Methodology................................................................ 17
5.2 Power Simulation Software................................................................................... 19
6 Reference Thermal Solutions............................................................................................21
6.1 Operating Environment......................................................................................... 21
6.2 Mechanical Design Envelope ............................................................................... 21
6.3 Thermal Solution Assembly.................................................................................. 23
6.3.1 Heatsink Orientations............................................................................ 25
6.3.2 Extruded Heatsink Profiles.................................................................... 26
6.3.3 Mechanical Interface Material ............................................................... 27
6.3.4 Thermal Interface Material.................................................................... 27
6.3.5 Heatsink Clip......................................................................................... 27
6.3.6 Clip Retention Anchors ......................................................................... 28
6.3.7 Board Level Component Keep-Out Dimensions................................... 28
6.4 Reliability Guidelines............................................................................................. 30
Appendix A: Thermal Solution Component Suppliers............................................................................... 31
Appendix B: Mechanical Drawings ........................................................................................................... 33