Guidelines

2 Intel
®
7500 Chipset Thermal Mechanical Design Guide
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S
TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT,
COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel may make changes to specifications, product descriptions, and plans at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them.
The Intel® 7500 chipset may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available upon request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained
by calling 1-800-548-4725, or by visiting Intel’s website at http://www.intel.com.
Intel, Xeon, Itanium, and the Intel logo are trademarks of Intel Corporation in the U. S. and other countries.
Copyright© 2010, Intel Corporation. All rights reserved.
* Other brands and names may be claimed as the property of others.