Guide
Mechanical Drawings
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 103
Thermal/ Mechanical Specifications and Design Guide
Figure G-12. Processor 4U Heatsink Base Mechanical Drawing - G20943 Rev C
13
4
5678
B
C
D
A
123
4
5678
B
C
D
A
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
X
9 105.5
9 7056
4
10.1
94
4X 5.4
1
A
A
A
G20943 1 C
DWG. NO SHT. REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 1:1
CG20943D
REV
DRAWING NUMBER
SIZE
BRICKLAND EX HSINK AL BASE
TITLE
PTMI
DEPARTMENT
SEE NOTESSEE NOTES
FINISHMATERIAL
--
DATEAPPROVED BY
--
--
DATECHECKED BY
7/8/11T. BOYD
DATEDRAWN BY
7/8/11T. BOYD
DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MM
TOLERANCES:
.X ± 0.5 Angles ± 0.5 °
.XX ± 0.25
.XXX ± 0.125
THIRD ANGLE PROJECTION
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPR
- A PRELIMINARY DRAFT FOR REVIEW 7/8/11 TAB
C6 B MODIFY TO ELIMINATE SPRINGCUP E97837-002 FROM TOP ASSY 7/25/11 TAB
D5 C ADD FEATURES FOR FIN STIFFENER, WIEGHT REDUCTION CHANGES 9/21/11 TAB
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
NOTES UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES
UL 94 - UL FLAMABILITY TESTING
99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. 3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL. DIMENSIONS CALLED OUT ON THE
DRAWING SHALL CONFORM TO THE DEFAULT TOLERANCE BLOCK UNLESS OTHERISE
SPECIFIED. THE 3D MODEL SHALL CONTROL ALL FEATURES OF THIS PART NOT DEFINED
ON THE DRAWING. MODEL TO BE INTERPRETED USING DATUM A (PRIMARY), DATUM B
(SECONDARY), AND DATUM C (TERTIARY) PER THE DRAWING CALLOUT.
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT
A) TYPE: ALUMINUM ALLOY: ADC10 (REPORT ALLOY IN FAI STUDY)
B) MINIMUM THERMAL CONDUCTIVITY: 100 W/mK
4. PART TO BE CAST, EXTRUDED, MACHINED, OR A COMBINATION.
IF PART IS CAST, REFER TO THE FOLLOWING REQUIREMENTS:
A) DEGATE: .13 MM [.005 IN] MAXIMUM
B) FLASH & MISMATCH .13 MM [.005 IN] MAXIMUM
C) SINK .13 MM [.005 IN] MAXIMUM
D) EJECTOR MARKS: FLUSH TO MINUS .00 MM/-.25 MM [.000 IN/-.010 IN]
5. CRITICAL TO FUNCTION DIMENSION (CTF)
MEASURED
6 FINISH: MAY USE ENGINEERING APPROVED EQUIVALENT.
A) INDICATED SURFACES PER INTEL 99-0007-001, CLASS A.
B) INDICATED SURFACES PER INTEL 99-0007-001, CLASS B.
C) UNSPECIFIED SURFACES PER INTEL 99-0007-001, CLASS C.
D) TEXTURE INDICATED SURFACES PER MT-11020.
E) FINISH INDICATED SURFACES PER SPI D-2.
F) SURFACES WITH NO TEXTURE TO BE IN THE RANGE OF SPI B-2 TO SPI C-2.
G) NO TEXTURE.
7. ROUNDS REQUIRED FOR FINAL PRODUCTION CAST PART.
NOT REQUIRED FOR PROTOTYPE ORDER
8 HEAT PIPE AND CU CORE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER.
9 INDICATED DIMENSION DESCRIBES MAXIMUM VOLUME. SUPPLIER MAY
REMOVE MATERIAL FROM BASE TO REDUCE WEIGHT
10 INDICATED POCKET FEATURE IS FOR WEIGHT REDUCTION. THESE FEATURES ARE
A SUGGESTION ONLY. SUPPLIER MAY CHANGE POCKETS WITH INTEL PTMI APPROVAL.
2:1SCALE
8
SEE DETAIL A
10
8
4:1SCALE
ADETAIL
3
2
1
4
5
Intel® Xeon® Processor E7 V2
Product Family-based Platform -
HSINK AL BASE