Datasheet

Contents
4
5.2 Alphabetical Signals Reference ..........................................................................63
6.0 Thermal Specifications and Design Considerations.................................71
6.1 Thermal Specifications........................................................................................72
6.2 Thermal Analysis.................................................................................................72
6.2.1 Measurements For Thermal Specifications............................................72
6.2.1.1 Processor Case Temperature Measurement ............................72
7.0 Features.......................................................................................................................75
7.1 Power-On Configuration Options ........................................................................75
7.2 Clock Control and Low Power States..................................................................75
7.2.1 Normal State—State 1 ...........................................................................75
7.2.2 AutoHALT Powerdown State—State 2 .................................................. 75
7.2.3 Stop-Grant State—State 3 .....................................................................76
7.2.4 HALT/Grant Snoop State—State 4 ........................................................77
7.2.5 Sleep State—State 5..............................................................................77
7.2.6 Deep Sleep State—State 6 ....................................................................78
7.3 Thermal Monitor ..................................................................................................78
7.3.1 Thermal Diode........................................................................................79
8.0 Boxed Processor Specifications................................................................................81
8.1 Introduction .........................................................................................................81
8.2 Mechanical Specifications...................................................................................81
8.2.1 Boxed Processor Fan Heatsink Dimensions..........................................82
8.2.2 Boxed Processor Fan Heatsink Weight..................................................83
8.2.3 Boxed Processor Retention Mechanism and Fan Heatsink Supports....83
8.3 Boxed Processor Requirements .........................................................................84
8.3.1 Fan Heatsink Power Supply...................................................................84
8.4 Thermal Specifications........................................................................................85
8.4.1 Boxed Processor Cooling Requirements ...............................................85
8.4.2 Variable Speed Fan ...............................................................................87
9.0 Debug Tools Specifications........................................................................................89
9.1 Logic Analyzer Interface (LAI)............................................................................89
9.1.1 Mechanical Considerations ....................................................................89
9.1.2 Electrical Considerations........................................................................89