Desktop 4th Generation Specification Sheet
Table Of Contents
- Contents
- Revision History
- 1.0 Introduction
- 2.0 Interfaces
- 3.0 Technologies
- 3.1 Intel® Virtualization Technology (Intel® VT)
- 3.2 Intel® Trusted Execution Technology (Intel® TXT)
- 3.3 Intel® Hyper-Threading Technology (Intel® HT Technology)
- 3.4 Intel® Turbo Boost Technology 2.0
- 3.5 Intel® Advanced Vector Extensions 2.0 (Intel® AVX2)
- 3.6 Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI)
- 3.7 Intel® Transactional Synchronization Extensions - New Instructions (Intel® TSX-NI)
- 3.8 Intel® 64 Architecture x2APIC
- 3.9 Power Aware Interrupt Routing (PAIR)
- 3.10 Execute Disable Bit
- 3.11 Supervisor Mode Execution Protection (SMEP)
- 4.0 Power Management
- 4.1 Advanced Configuration and Power Interface (ACPI) States Supported
- 4.2 Processor Core Power Management
- 4.3 Integrated Memory Controller (IMC) Power Management
- 4.4 PCI Express* Power Management
- 4.5 Direct Media Interface (DMI) Power Management
- 4.6 Graphics Power Management
- 5.0 Thermal Management
- 5.1 Desktop Processor Thermal Profiles
- 5.2 Thermal Metrology
- 5.3 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 1.1
- 5.4 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 2.0
- 5.5 Processor Temperature
- 5.6 Adaptive Thermal Monitor
- 5.7 THERMTRIP# Signal
- 5.8 Digital Thermal Sensor
- 5.9 Intel® Turbo Boost Technology Thermal Considerations
- 6.0 Signal Description
- 6.1 System Memory Interface Signals
- 6.2 Memory Reference and Compensation Signals
- 6.3 Reset and Miscellaneous Signals
- 6.4 PCI Express*-Based Interface Signals
- 6.5 Display Interface Signals
- 6.6 Direct Media Interface (DMI)
- 6.7 Phase Locked Loop (PLL) Signals
- 6.8 Testability Signals
- 6.9 Error and Thermal Protection Signals
- 6.10 Power Sequencing Signals
- 6.11 Processor Power Signals
- 6.12 Sense Signals
- 6.13 Ground and Non-Critical to Function (NCTF) Signals
- 6.14 Processor Internal Pull-Up / Pull-Down Terminations
- 7.0 Electrical Specifications
- 8.0 Package Mechanical Specifications
- 9.0 Processor Ball and Signal Information

Tables
1 Terminology........................................................................................................... 13
2 Related Documents..................................................................................................16
3 Processor DIMM Support by Product...........................................................................19
4 Supported UDIMM Module Configurations....................................................................19
5 Supported SO-DIMM Module Configurations (AIO Only)................................................ 20
6 DDR3 / DDR3L System Memory Timing Support...........................................................20
7 PCI Express* Supported Configurations in Desktop Products..........................................23
8 Processor Supported Audio Formats over HDMI*and DisplayPort*.................................. 35
9 Valid Three Display Configurations through the Processor..............................................36
10 DisplayPort and embedded DisplayPort* Resolutions for 1, 2, 4 Lanes – Link Data
Rate of RBR, HBR, and HBR2.....................................................................................36
11 System States.........................................................................................................50
12 Processor Core / Package State Support..................................................................... 50
13 Integrated Memory Controller States..........................................................................50
14 PCI Express* Link States.......................................................................................... 50
15 Direct Media Interface (DMI) States........................................................................... 51
16 G, S, and C Interface State Combinations .................................................................. 51
17 D, S, and C Interface State Combination.....................................................................51
18 Coordination of Thread Power States at the Core Level................................................. 53
19 Coordination of Core Power States at the Package Level............................................... 56
20 Deepest Package C-State Available............................................................................ 59
21 Desktop Processor Thermal Specifications................................................................... 66
22 Thermal Test Vehicle Thermal Profile for Processor (PCG 2013D) ...................................67
23 Thermal Test Vehicle Thermal Profile for Processor (PCG 2013C)....................................68
24 Thermal Test Vehicle Thermal Profile for Processor (PCG 2013B)....................................69
25 Thermal Test Vehicle Thermal Profile for Processor (PCG 2013A)....................................70
26 Digital Thermal Sensor (DTS) 1.1 Thermal Solution Performance Above T
CONTROL
............. 73
27 Thermal Margin Slope.............................................................................................. 74
28 Intel
®
Turbo Boost Technology 2.0 Package Power Control Settings............................... 80
29 Signal Description Buffer Types................................................................................. 82
30 Memory Channel A Signals........................................................................................82
31 Memory Channel B Signals........................................................................................83
32 Memory Reference and Compensation Signals............................................................. 84
33 Reset and Miscellaneous Signals................................................................................ 85
34 PCI Express* Graphics Interface Signals..................................................................... 86
35 Display Interface Signals.......................................................................................... 86
36 Direct Media Interface (DMI) – Processor to PCH Serial Interface................................... 86
37 Phase Locked Loop (PLL) Signals............................................................................... 87
38 Testability Signals....................................................................................................87
39 Error and Thermal Protection Signals..........................................................................88
40 Power Sequencing Signals........................................................................................ 88
41 Processor Power Signals........................................................................................... 89
42 Sense Signals......................................................................................................... 89
43 Ground and Non-Critical to Function (NCTF) Signals..................................................... 89
44 Processor Internal Pull-Up / Pull-Down Terminations.................................................... 89
45 Voltage Regulator (VR) 12.5 Voltage Identification....................................................... 91
46 Signal Groups......................................................................................................... 95
47 Processor Core Active and Idle Mode DC Voltage and Current Specifications.................... 98
48 Memory Controller (V
DDQ
) Supply DC Voltage and Current Specifications.........................99
49 VCCIO_OUT, VCOMP_OUT, and VCCIO_TERM ........................................................... 100
50 DDR3 / DDR3L Signal Group DC Specifications...........................................................100
51 Digital Display Interface Group DC Specifications....................................................... 101
52 embedded DisplayPort* (eDP*) Group DC Specifications............................................. 102
53 CMOS Signal Group DC Specifications.......................................................................102
Tables—Processor
Desktop 4th Generation Intel
®
Core
™
Processor Family, Desktop Intel
®
Pentium
®
Processor Family, and Desktop Intel
®
Celeron
®
Processor Family
December 2013 Datasheet – Volume 1 of 2
Order No.: 328897-004 7