Desktop 4th Generation Specification Sheet
Table Of Contents
- Contents
- Revision History
- 1.0 Introduction
- 2.0 Interfaces
- 3.0 Technologies
- 3.1 Intel® Virtualization Technology (Intel® VT)
- 3.2 Intel® Trusted Execution Technology (Intel® TXT)
- 3.3 Intel® Hyper-Threading Technology (Intel® HT Technology)
- 3.4 Intel® Turbo Boost Technology 2.0
- 3.5 Intel® Advanced Vector Extensions 2.0 (Intel® AVX2)
- 3.6 Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI)
- 3.7 Intel® Transactional Synchronization Extensions - New Instructions (Intel® TSX-NI)
- 3.8 Intel® 64 Architecture x2APIC
- 3.9 Power Aware Interrupt Routing (PAIR)
- 3.10 Execute Disable Bit
- 3.11 Supervisor Mode Execution Protection (SMEP)
- 4.0 Power Management
- 4.1 Advanced Configuration and Power Interface (ACPI) States Supported
- 4.2 Processor Core Power Management
- 4.3 Integrated Memory Controller (IMC) Power Management
- 4.4 PCI Express* Power Management
- 4.5 Direct Media Interface (DMI) Power Management
- 4.6 Graphics Power Management
- 5.0 Thermal Management
- 5.1 Desktop Processor Thermal Profiles
- 5.2 Thermal Metrology
- 5.3 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 1.1
- 5.4 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 2.0
- 5.5 Processor Temperature
- 5.6 Adaptive Thermal Monitor
- 5.7 THERMTRIP# Signal
- 5.8 Digital Thermal Sensor
- 5.9 Intel® Turbo Boost Technology Thermal Considerations
- 6.0 Signal Description
- 6.1 System Memory Interface Signals
- 6.2 Memory Reference and Compensation Signals
- 6.3 Reset and Miscellaneous Signals
- 6.4 PCI Express*-Based Interface Signals
- 6.5 Display Interface Signals
- 6.6 Direct Media Interface (DMI)
- 6.7 Phase Locked Loop (PLL) Signals
- 6.8 Testability Signals
- 6.9 Error and Thermal Protection Signals
- 6.10 Power Sequencing Signals
- 6.11 Processor Power Signals
- 6.12 Sense Signals
- 6.13 Ground and Non-Critical to Function (NCTF) Signals
- 6.14 Processor Internal Pull-Up / Pull-Down Terminations
- 7.0 Electrical Specifications
- 8.0 Package Mechanical Specifications
- 9.0 Processor Ball and Signal Information
Figures
1 Platform Block Diagram ........................................................................................... 11
2 Intel
®
Flex Memory Technology Operations................................................................. 21
3 PCI Express* Related Register Structures in the Processor............................................ 25
4 PCI Express* Typical Operation 16 Lanes Mapping....................................................... 26
5 Processor Graphics Controller Unit Block Diagram........................................................ 29
6 Processor Display Architecture...................................................................................32
7 DisplayPort* Overview............................................................................................. 33
8 HDMI* Overview..................................................................................................... 34
9 PECI Host-Clients Connection Example....................................................................... 38
10 Device to Domain Mapping Structures........................................................................ 42
11 Processor Power States............................................................................................ 49
12 Idle Power Management Breakdown of the Processor Cores ..........................................52
13 Thread and Core C-State Entry and Exit......................................................................53
14 Package C-State Entry and Exit................................................................................. 57
15 Thermal Test Vehicle Thermal Profile for Processor (PCG 2013D)....................................67
16 Thermal Test Vehicle Thermal Profile for Processor (PCG 2013C)....................................68
17 Thermal Test Vehicle Thermal Profile for Processor (PCG 2013B)....................................69
18 Thermal Test Vehicle Thermal Profile for Processor (PCG 2013A)....................................70
19 Thermal Test Vehicle (TTV) Case Temperature (T
CASE
) Measurement Location..................71
20 Digital Thermal Sensor (DTS) 1.1 Definition Points.......................................................72
21 Digital Thermal Sensor (DTS) Thermal Profile Definition................................................74
22 Package Power Control............................................................................................. 81
23 Input Device Hysteresis.......................................................................................... 104
24 Processor Package Assembly Sketch.........................................................................105
25 Processor Top-Side Markings................................................................................... 107
26 Processor Package Land Coordinates........................................................................ 108
Processor—Figures
Desktop 4th Generation Intel
®
Core
™
Processor Family, Desktop Intel
®
Pentium
®
Processor Family, and Desktop Intel
®
Celeron
®
Processor Family
Datasheet – Volume 1 of 2 December 2013
6 Order No.: 328897-004