Desktop 4th Generation Specification Sheet
Table Of Contents
- Contents
- Revision History
- 1.0 Introduction
- 2.0 Interfaces
- 3.0 Technologies
- 3.1 Intel® Virtualization Technology (Intel® VT)
- 3.2 Intel® Trusted Execution Technology (Intel® TXT)
- 3.3 Intel® Hyper-Threading Technology (Intel® HT Technology)
- 3.4 Intel® Turbo Boost Technology 2.0
- 3.5 Intel® Advanced Vector Extensions 2.0 (Intel® AVX2)
- 3.6 Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI)
- 3.7 Intel® Transactional Synchronization Extensions - New Instructions (Intel® TSX-NI)
- 3.8 Intel® 64 Architecture x2APIC
- 3.9 Power Aware Interrupt Routing (PAIR)
- 3.10 Execute Disable Bit
- 3.11 Supervisor Mode Execution Protection (SMEP)
- 4.0 Power Management
- 4.1 Advanced Configuration and Power Interface (ACPI) States Supported
- 4.2 Processor Core Power Management
- 4.3 Integrated Memory Controller (IMC) Power Management
- 4.4 PCI Express* Power Management
- 4.5 Direct Media Interface (DMI) Power Management
- 4.6 Graphics Power Management
- 5.0 Thermal Management
- 5.1 Desktop Processor Thermal Profiles
- 5.2 Thermal Metrology
- 5.3 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 1.1
- 5.4 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 2.0
- 5.5 Processor Temperature
- 5.6 Adaptive Thermal Monitor
- 5.7 THERMTRIP# Signal
- 5.8 Digital Thermal Sensor
- 5.9 Intel® Turbo Boost Technology Thermal Considerations
- 6.0 Signal Description
- 6.1 System Memory Interface Signals
- 6.2 Memory Reference and Compensation Signals
- 6.3 Reset and Miscellaneous Signals
- 6.4 PCI Express*-Based Interface Signals
- 6.5 Display Interface Signals
- 6.6 Direct Media Interface (DMI)
- 6.7 Phase Locked Loop (PLL) Signals
- 6.8 Testability Signals
- 6.9 Error and Thermal Protection Signals
- 6.10 Power Sequencing Signals
- 6.11 Processor Power Signals
- 6.12 Sense Signals
- 6.13 Ground and Non-Critical to Function (NCTF) Signals
- 6.14 Processor Internal Pull-Up / Pull-Down Terminations
- 7.0 Electrical Specifications
- 8.0 Package Mechanical Specifications
- 9.0 Processor Ball and Signal Information

4.2.3 Requesting Low-Power Idle States...............................................................53
4.2.4 Core C-State Rules....................................................................................54
4.2.5 Package C-States......................................................................................55
4.2.6 Package C-States and Display Resolutions....................................................59
4.3 Integrated Memory Controller (IMC) Power Management............................................60
4.3.1 Disabling Unused System Memory Outputs...................................................60
4.3.2 DRAM Power Management and Initialization..................................................61
4.3.3 DRAM Running Average Power Limitation (RAPL) .........................................63
4.3.4 DDR Electrical Power Gating (EPG).............................................................. 63
4.4 PCI Express* Power Management............................................................................63
4.5 Direct Media Interface (DMI) Power Management...................................................... 63
4.6 Graphics Power Management..................................................................................64
4.6.1 Intel
®
Rapid Memory Power Management (Intel
®
RMPM)................................64
4.6.2 Graphics Render C-State............................................................................64
4.6.3 Intel
®
Graphics Dynamic Frequency............................................................ 64
5.0 Thermal Management................................................................................................. 65
5.1 Desktop Processor Thermal Profiles......................................................................... 66
5.1.1 Processor (PCG 2013D) Thermal Profile........................................................67
5.1.2 Processor (PCG 2013C) Thermal Profile........................................................68
5.1.3 Processor (PCG 2013B) Thermal Profile........................................................69
5.1.4 Processor (PCG 2013A) Thermal Profile........................................................70
5.2 Thermal Metrology................................................................................................ 71
5.3 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 1.1.............................. 71
5.4 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 2.0.............................. 73
5.5 Processor Temperature..........................................................................................74
5.6 Adaptive Thermal Monitor...................................................................................... 75
5.7 THERMTRIP# Signal.............................................................................................. 78
5.8 Digital Thermal Sensor.......................................................................................... 78
5.8.1 Digital Thermal Sensor Accuracy (Taccuracy)................................................79
5.9 Intel
®
Turbo Boost Technology Thermal Considerations..............................................79
5.9.1 Intel
®
Turbo Boost Technology Power Control and Reporting.......................... 79
5.9.2 Package Power Control.............................................................................. 80
5.9.3 Turbo Time Parameter............................................................................... 81
6.0 Signal Description....................................................................................................... 82
6.1 System Memory Interface Signals........................................................................... 82
6.2 Memory Reference and Compensation Signals.......................................................... 84
6.3 Reset and Miscellaneous Signals............................................................................. 85
6.4 PCI Express*-Based Interface Signals......................................................................86
6.5 Display Interface Signals....................................................................................... 86
6.6 Direct Media Interface (DMI).................................................................................. 86
6.7 Phase Locked Loop (PLL) Signals.............................................................................87
6.8 Testability Signals.................................................................................................87
6.9 Error and Thermal Protection Signals.......................................................................88
6.10 Power Sequencing Signals.................................................................................... 88
6.11 Processor Power Signals.......................................................................................89
6.12 Sense Signals..................................................................................................... 89
6.13 Ground and Non-Critical to Function (NCTF) Signals.................................................89
6.14 Processor Internal Pull-Up / Pull-Down Terminations................................................ 89
Processor—Contents
Desktop 4th Generation Intel
®
Core
™
Processor Family, Desktop Intel
®
Pentium
®
Processor Family, and Desktop Intel
®
Celeron
®
Processor Family
Datasheet – Volume 1 of 2 December 2013
4 Order No.: 328897-004