Desktop 4th Generation Specification Sheet
Table Of Contents
- Contents
- Revision History
- 1.0 Introduction
- 2.0 Interfaces
- 3.0 Technologies
- 3.1 Intel® Virtualization Technology (Intel® VT)
- 3.2 Intel® Trusted Execution Technology (Intel® TXT)
- 3.3 Intel® Hyper-Threading Technology (Intel® HT Technology)
- 3.4 Intel® Turbo Boost Technology 2.0
- 3.5 Intel® Advanced Vector Extensions 2.0 (Intel® AVX2)
- 3.6 Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI)
- 3.7 Intel® Transactional Synchronization Extensions - New Instructions (Intel® TSX-NI)
- 3.8 Intel® 64 Architecture x2APIC
- 3.9 Power Aware Interrupt Routing (PAIR)
- 3.10 Execute Disable Bit
- 3.11 Supervisor Mode Execution Protection (SMEP)
- 4.0 Power Management
- 4.1 Advanced Configuration and Power Interface (ACPI) States Supported
- 4.2 Processor Core Power Management
- 4.3 Integrated Memory Controller (IMC) Power Management
- 4.4 PCI Express* Power Management
- 4.5 Direct Media Interface (DMI) Power Management
- 4.6 Graphics Power Management
- 5.0 Thermal Management
- 5.1 Desktop Processor Thermal Profiles
- 5.2 Thermal Metrology
- 5.3 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 1.1
- 5.4 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 2.0
- 5.5 Processor Temperature
- 5.6 Adaptive Thermal Monitor
- 5.7 THERMTRIP# Signal
- 5.8 Digital Thermal Sensor
- 5.9 Intel® Turbo Boost Technology Thermal Considerations
- 6.0 Signal Description
- 6.1 System Memory Interface Signals
- 6.2 Memory Reference and Compensation Signals
- 6.3 Reset and Miscellaneous Signals
- 6.4 PCI Express*-Based Interface Signals
- 6.5 Display Interface Signals
- 6.6 Direct Media Interface (DMI)
- 6.7 Phase Locked Loop (PLL) Signals
- 6.8 Testability Signals
- 6.9 Error and Thermal Protection Signals
- 6.10 Power Sequencing Signals
- 6.11 Processor Power Signals
- 6.12 Sense Signals
- 6.13 Ground and Non-Critical to Function (NCTF) Signals
- 6.14 Processor Internal Pull-Up / Pull-Down Terminations
- 7.0 Electrical Specifications
- 8.0 Package Mechanical Specifications
- 9.0 Processor Ball and Signal Information
Figure 1. Platform Block Diagram
Processor
PCI Express* 3.0
Digital Display
Interface (DDI)
(3 interfaces)
System Memory
1333 / 1600 MT/s
2 DIMMs / CH
CH A
CH B
Intel
®
Flexible Display
Interface (Intel
®
FDI)
(x2)
Direct Media Interface 2.0
(DMI 2.0) (x4)
Note: 2 DIMMs / CH is not
supported on all SKUs.
Platform Controller
Hub (PCH)
SATA, 6 GB/s
(up to 6 Ports)
Analog Display
(VGA)
SPI Flash
Super IO / EC
Trusted Platform
Module (TPM) 1.2
LPC
Intel
®
High
Definition Audio
(Intel
®
HD Audio)
Integrated LAN
USB 3.0
(up to 6 Ports)
USB 2.0
(8 Ports)
PCI Express* 2.0
(up to 8 Ports)
SPI
SMBus 2.0
GPIOs
Supported Technologies
• Intel
®
Virtualization Technology (Intel
®
VT)
• Intel
®
Active Management Technology 9.5 (Intel
®
AMT 9.5 )
• Intel
®
Trusted Execution Technology (Intel
®
TXT)
• Intel
®
Streaming SIMD Extensions 4.2 (Intel
®
SSE4.2)
• Intel
®
Hyper-Threading Technology (Intel
®
HT Technology)
• Intel
®
64 Architecture
• Execute Disable Bit
• Intel
®
Turbo Boost Technology 2.0
• Intel
®
Advanced Vector Extensions 2.0 (Intel
®
AVX2)
• Intel
®
Advanced Encryption Standard New Instructions (Intel
®
AES-NI)
1.1
Introduction—Processor
Desktop 4th Generation Intel
®
Core
™
Processor Family, Desktop Intel
®
Pentium
®
Processor Family, and Desktop Intel
®
Celeron
®
Processor Family
December 2013 Datasheet – Volume 1 of 2
Order No.: 328897-004 11