User's Manual
Table Of Contents
- Contents
- Figures
- Tables
- Revision History
- Introduction
- Packaging Technology
- Thermal Specifications
- Thermal Simulation
- Thermal Metrology
- Reference Thermal Solution
- Appendix A: Thermal Solution Component Suppliers
- Appendix B: Mechanical Drawings
Reference Thermal Solution
R
Intel
®
955X Express Chipset Thermal/Mechanical Design Guide 19
Figure 6-2. Heatsink Volumetric Envelope for the MCH
TN B
Motherboard
Heatsink Base
Die
FCBGA + Solder
Balls
Heatsink Fin
Heatsink Fin
Ramp
Retainer
TIM
33.50 mm
26.79 mm
48.0 mm
60.6 mm
47.0 mm
135
O
45.79 mm
67.0 mm
81.0 mm
60.92 mm
Max 2.2 m m
Component
Height
No
component
this Area
1.90 mm
2.50 mm
HS_Vol_Envelope_MCH