Xeon Processor E3-1200 Family Specification Sheet

Component Suppliers
94 Thermal/Mechanical Specifications and Design Guidelines
The enabled components may not be currently available from all suppliers. Contact the
supplier directly to verify time of component availability.
§
LGA115x ILM
cover only
G12451-001 012-1000-5377 475973003 1-2134503-1
ACA-ZIF-127-
P01
LGA115x ILM Back
Plate (with
screws)
E36143-002 PT44P19-6401 475969930 2069838-2
DCA-HSK-144-
Y09
1U ILM Back Plate
(with Screws)
E66807-001 PT44P18-6401 N/A N/A DCA-HSK-157-
Y03
Table A-5. Supplier Contact Information
Supplier Contact Phone Email
AVC
(Asia Vital
Components Co.,
Ltd.)
Kai Chang [phone]
x63588
[e-mail]
Delta William Bradshaw [phone]
[phone]
[e-mail]
Foxconn Julia Jiang
(for socket and ILM)
Ray Wang
(for heatsink)
[phone]
[phone]
[e-mail]
[e-mail]
ITW Fastex Chak Chakir [phone] [e-mail]
Lotes Co., Ltd. Windy Wong [phone] [e-mail]
Molex Carol Liang [phone] x3301 [e-mail]
Nidec Karl Mattson [phone] [e-mail]
Tyco Billy Hsieh [phone] [e-mail]
Table A-4. LGA1155 Socket and ILM Components (Sheet 2 of 2)
Item Intel PN Foxconn Molex Tyco Lotes