Data Sheet

Ethernet Controller I210 —Thermal Considerations
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13.8 PCB Layout Guidelines
The following general PCB design guidelines are recommended to maximize the thermal performance of
QFN packages:
• When connecting ground (thermal) vias to the ground planes, do not use thermal-relief patterns.
• Thermal-relief patterns are designed to limit heat transfer between the vias and the copper planes,
thus constricting the heat flow path from the component to the ground planes in the PCB.
• As board temperature also has an effect on the thermal performance of the package, avoid placing
the I210 adjacent to high-power dissipation devices.
• If airflow exists, locate the components in the mainstream of the airflow path for maximum thermal
performance. Avoid placing the components downstream, behind larger devices or devices with
heat sinks that obstruct or significantly preheat the air flow.
Note: The previous information is provided as a general guideline to help maximize the thermal
performance of the components.
13.9 Conclusion
Increasingly complex systems require more robust and well thought out thermal solutions. The use of
system air, ducting, passive or active heat sinks, or any combination thereof can help lead to a low cost
solution that meets your environmental constraints.
The simplest and most cost-effective method is to improve the inherent system cooling characteristics
through careful design and placement of fans, vents, and ducts. When additional cooling is required,
thermal enhancements can be implemented in conjunction with enhanced system cooling. The size of
the fan or heat sink can be varied to balance size and space constraints with acoustic noise.
Use the data and methodologies in this section as a starting point when designing and validating a
thermal solution for the I210. By maintaining the I210’s case temperature below those recommended
in this section, the I210 functions properly and reliably.