Data Sheet
Ethernet Controller I210 —Thermal Considerations
846
13.5.3 Simulation Setup
A simulation environment conforming to the JEDEC JESD51-2 standard was developed using a 101.5
mm x 114.5 mm, 2s2p board according to JEDEC JESD 51-9. Simulations were run with different
combinations of ambient temperature and airflow speed one solution scenario, as follows:
•No heat sink
Note: Keep the following in mind when reviewing the data that is included in this section:
• All data is preliminary and is not validated against physical samples.
• Your system design might be significantly different.
• A larger board with more than four copper layers might improve the I210 thermal performance.
13.6 Simulation Results
Table 1 lists the T
case
as a function of airflow and ambient temperature with the component operating
at the Thermal Design Power (TDP) in the environment previously listed. This table can be used as an
aid in determining a starting point for the optimum airflow for the I210.
Again, your system design might vary considerably from the environment used to generate these
values.
Note: Thermal models are available upon request (Flotherm: Detailed Model). Contact your local
Intel sales representative for the I210 thermal models.
Table 13-25. Thermal Simulation Results for Various Environmental Conditions
Note: The red value(s) indicate airflow/ambient combinations that exceed the allowable case
temperature.
Airflow(LFM)
T
C
0 50 100 150 200 250 300 350 400
45 68.49 65.06 65.06 65.06 65.06 65.06 65.06 65.06
65.06
50 73.33 69.98 69.24 69.24 69.24 69.24 69.24 69.24 69.24
55 78.16 74.89 74.18 73.74 73.42 73.17 72.97 72.79 72.64
60 83 79.82 79.13 78.7 78.38 78.14 77.94 77.77 77.61
65 87.74 84.74 84.07 83.65 83.35 83.11 82.91 82.74 82.59
70 92.68 89.66 89.02 88.61 88.31 88.08 87.88 87.71 87.56
75 99.3 96.17 95.5 95.07 94.76 94.51 94.3 94.12
93.96
80 104.1 101.1 100.4 100 99.72 99.47 99.27 99.09 98.93
85 109 106 105.4 105 104.7 104.4 104.2 104.1 103.9
No Heat Sink
0.74W
0.80W
Ambient Temperature (C)