Data Sheet

Ethernet Controller I210 —Design Considerations
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12.9 Assembly Process Flow
Figure 12-26 shows the typical process flow for mounting packages to the PCB.
Figure 12-26.Assembly Flow
12.10 Reflow Guidelines
The typical reflow profile consists of four sections. In the preheat section, the PCB assembly should be
preheated at the rate of 1 to 2 °C/sec to start the solvent evaporation and to avoid thermal shock. The
assembly should then be thermally soaked for 60 to 120 seconds to remove any volatile solder paste
and for activation of flux. The reflow section of the profile, the time above liquidus should be between
45 to 60 seconds with a peak temperature in the range of 245 to 250 °C, and the duration at the peak
should not exceed 30 seconds. Finally, the assembly should undergo cool down in the fourth section of
the profile. A typical profile band is provided in Figure 12-27, in which 220 °C is referred to as an
approximation of the liquidus point. The actual profile parameters depend upon the solder paste used
and specific recommendations from the solder paste manufacturers should be followed.