Data Sheet
Ethernet Controller I210 —Revision History
4
Rev Date Notes
2.3 June 2013
• Revised section 1.3.1 (Audio/Video Bridging Support).
• Revised section 6.7.1.2 (Common Firmware Parameters 1 - Offset 0x1; bit 15).
• Revised section 7.1.2.10 (Receive-Side Scaling (RSS).
• Revised section 7.8.3.1 (Capture Timestamp Mechanism).
• Revised section 8.21.18 (Flexible Host Filter Table Registers - FHFT (0x9000 + 4*n
[n=0...255]; RW); updated note.
• Revised section 8.27.3.23 (MAC Specific Control Register 1 - Page 2, Register 16; bits 9:8).
• Revised table 10-37 (Decision Filter Values).
2.2 April 2013
• Updated title page (Platform Power Efficiency description).
• Revised VPD Area Update Flow description (section 3.3.9.3.2).
• Revised iNVM description (section 3.4).
• Added line loopback information (section 3.7.6.6).
• Revised Acquiring Ownership Over a Shared Resource description (section 4.6.1).
• Revised Releasing Ownership Over a Shared Resource description (section 4.6.2).
• Revised Dr Disable Mode description (section 5.2.4.1).
• Revised Device Rev ID (section 6.2.19).
• Revised Common Firmware Parameters 1 - Offset 0x1 (section 6.7.1.2).
• Updated Compatibility (Word 0x03) bit 11 description (section 6.8.1).
• Updated Setup Options PCIe Function 0 (Word 0x30) bit 5 description (section 6.8.6.1).
• Added PXE VLAN Flash settings (Sections 6.8.6.5 through 6.8.6.9).
• Updated Software Semaphore - SWSM (0x5B50; R/W)
• Removed Firmware Status Register (0x8F0C) entry from Table 8-6.
• Revised note (changed . . . has both F and L flags off to on (section 10.5.7.1).
• Revised Specification for XTAL1 (In); table 11.16.
• Revised Third-Party Magnetics Manufacturers table (section 12.5.3).
• Added Power Delivery Solutions (section 12.7.1).
2.1 November 2012
• Revised table 11.1 - Absolute Maximum Ratings
• Revised section 12.5.3 - Third-Party Magnetics Manufacturers.
• Revised table 12.16 - Absolute Maximum Case Temperature.
• Revised table 12.17 - Thermal Simulation Results for Various Environmental Conditions.
2.0 November 2012
The following sections were revised:
• 1.0 Introduction.
• 3.0 Interconnects.
•6.0 Flash Map.
• 7.0 Inline Functions.
• 8.0 Programming Interface.
• 9.0 PCIe Programming Interface.
• 11.0 Electrical/Mechanical Specification.
• 12.0 Design Considerations.
• 14.0 Diagnostics
• Added new section 13.0 - Thermal Considerations.
1.9 October 2012
• Initial Release (Intel Public).