Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide February 2004 Order Number: 300682-001
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Contents Contents 1.0 Introduction....................................................................................................................................5 1.1 1.2 Definition of Terms................................................................................................................ 5 Reference Documents ..........................................................................................................6 2.0 Packaging Technology ............................................
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Introduction 1.0 Introduction As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Heat may be dissipated using improved system cooling and/or attaching passive heatsinks. The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within functional limits.
Introduction 1.2 Table 2. Reference Documents Reference Documents Document Intel® 6300ESB I/O Controller Hub Datasheet Thermal Design Suggestions for Various Form Factors Document Number / Location 300641 http://www.formfactors.
Packaging Technology 2.0 Packaging Technology The Intel 6300ESB ICH component is available in a 37.5 mm square package as shown in Appendix A, “Mechanical Drawings”. Package information is also provided in the Intel® 6300ESB I/O Controller Hub Datasheet.
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Thermal Specifications 3.0 Thermal Specifications 3.1 Case Temperature and Thermal Design Power To ensure proper operation and reliability of the Intel 6300ESB ICH component, the case and junction temperatures must be at or below the values specified in Table 3. System and/or component level thermal solutions are required to maintain the case temperature below the maximum temperature specification while dissipating the thermal design power (TDP) listed in Table 3. Table 3.
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Reference Thermal Solution 4.0 Reference Thermal Solution Based on a component local operating environment of natural convection (zero LFM of airflow) with a maximum local-ambient temperature of 55° C, the Intel 6300ESB ICH component does not require an attached heatsink to meet thermal specifications. For systems where the local-ambient temperature is severe (greater than 55° C, natural convection), a component level thermal solution or system thermal solution improvement may be required.
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Mechanical Drawings Appendix A Mechanical Drawings Figure 1 shows the package dimensions for the Intel 6300ESB ICH. Unless otherwise specified, the units in the figure are in millimeters.
Mechanical Drawings Figure 1.
