Datasheet

Thermal Specifications and Design Considerations
72 Datasheet
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 24 instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to Section 5.2. In all cases the Thermal Monitor and
Thermal Monitor 2 feature must be enabled for the processor to remain within
specification.
Table 24. Processor Thermal Specifications
Processor
Numbers
Core
Frequency
(GHz)
Thermal
Design
Power (W)
Extended
HALT Power
(W)
1
NOTES:
1. Specification is at 50 °C T
C
and typical voltage loadline.
Minimum
T
C
(°C)
Maximum T
C
(°C)
Notes
QX6800 2.93 130 50 5 See Table 25
and Figure 13
2, 3
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP
is not the maximum power that the processor can dissipate.
3. This table shows the maximum TDP for a given frequency range. Individual processors may have
a lower TDP. Therefore, the maximum T
C
will vary depending on the TDP of the individual processor.
Please refer to thermal profile figure and associated table for the allowed combinations of power
and T
C
.