Datasheet

Datasheet 5
Figures
1V
CC
Static and Transient Tolerance.............................................................................20
2V
CC
Overshoot Example Waveform.............................................................................21
3 Differential Clock Waveform ......................................................................................28
4 Differential Clock Crosspoint Specification ...................................................................29
5 Processor Package Assembly Sketch...........................................................................31
6 Processor Package Drawing Sheet 1 of 3 .....................................................................32
7 Processor Package Drawing Sheet 2 of 3 .....................................................................33
8 Processor Package Drawing Sheet 3 of 3 .....................................................................34
9 Processor Top-Side Markings .....................................................................................36
10 Processor Land Coordinates and Quadrants, Top View...................................................37
11 land-out Diagram (Top View – Left Side).....................................................................40
12 land-out Diagram (Top View – Right Side)...................................................................41
13 Thermal Profile 130 W Processors...............................................................................74
14 Case Temperature (TC) Measurement Location ............................................................75
15 Thermal Monitor 2 Frequency and Voltage Ordering......................................................77
16 Conceptual Fan Control on PECI-Based Platforms .........................................................79
17 Processor Low Power State Machine ...........................................................................82
Tables
1 References..............................................................................................................11
2 Voltage Identification Definition .................................................................................15
3 Absolute Maximum and Minimum Ratings....................................................................17
4 Voltage and Current Specifications .............................................................................18
5V
CC
Static and Transient Tolerance.............................................................................19
6 Vcc Overshoot Specifications .....................................................................................20
7 FSB Signal Groups ...................................................................................................22
8 Signal Characteristics ...............................................................................................23
9 Signal Reference Voltages.........................................................................................23
10 GTL+ Signal Group DC Specifications..........................................................................24
11 Open Drain and TAP Output Signal Group DC Specifications...........................................24
12 CMOS Signal Group DC Specifications.........................................................................25
13 GTL+ Bus Voltage Definitions ....................................................................................26
14 Core Frequency to FSB Multiplier Configuration ............................................................27
15 BSEL[2:0] Frequency Table for BCLK[1:0]...................................................................27
16 Front Side Bus Differential BCLK Specifications.............................................................28
17 PECI DC Electrical Limits...........................................................................................30
18 Processor Loading Specifications ................................................................................35
19 Package Handling Guidelines .....................................................................................35
20 Processor Materials ..................................................................................................36
21 Alphabetical Land Assignments ..................................................................................42
22 Numerical Land Assignment.......................................................................................52
23 Signal Description....................................................................................................62
24 Processor Thermal Specifications................................................................................72
25 Thermal Profile 130 W Processors...............................................................................73
26 GetTemp0() and GetTemp1() Error Codes ...................................................................80
27 Power-On Configuration Option Signals.......................................................................81