Datasheet

4 Datasheet
5.2.5 THERMTRIP# Signal................................................................................78
5.3 Platform Environment Control Interface (PECI) ......................................................79
5.3.1 Introduction...........................................................................................79
5.3.1.1 Key Difference with Legacy Diode-Based Thermal Management .......79
5.3.2 PECI Specifications .................................................................................80
5.3.2.1 PECI Device Address..................................................................80
5.3.2.2 PECI Command Support.............................................................80
5.3.2.3 PECI Fault Handling Requirements...............................................80
5.3.2.4 PECI GetTemp0() and GetTemp1() Error Code Support...................80
6Features..................................................................................................................81
6.1 Power-On Configuration Options ..........................................................................81
6.2 Clock Control and Low Power States.....................................................................81
6.2.1 Normal State .........................................................................................82
6.2.2 HALT and Extended HALT Powerdown States..............................................82
6.2.2.1 HALT Powerdown State ..............................................................82
6.2.2.2 Extended HALT Powerdown State ................................................83
6.2.3 Stop Grant State ....................................................................................83
6.2.4 Extended HALT Snoop or HALT Snoop State,
Stop Grant Snoop State...........................................................................84
6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................84
6.2.4.2 Extended HALT Snoop State .......................................................84
7 Boxed Processor Specifications................................................................................85
8 Debug Tools Specifications ......................................................................................87
8.1 Logic Analyzer Interface (LAI) .............................................................................87
8.1.1 Mechanical Considerations .......................................................................87
8.1.2 Electrical Considerations..........................................................................87