Datasheet

Thermal Specifications and Design Considerations
82 Datasheet
Pentium
®
Processor Extreme Edition, and Intel
®
Pentium
®
4 Processor Thermal and
Mechanical Design Guidelines and the Processor Power Characterization Methodology
for the details of this methodology.
The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 26 instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to Section 5.2. In all cases the Thermal Monitor
feature must be enabled for the processor to remain within specification.
Table 26. Processor Thermal Specifications
Processor Number
Core
Frequency
(GHz)
Thermal
Design
Power (W)
Minimum
T
C
(°C)
Maximum T
C
(°C)
Notes
Extreme Edition 965 3.73 GHz 130 5
See Table 27
and Figure 13
1, 2
NOTES:
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the
maximum power that the processor can dissipate.
2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP.
Therefore, the maximum T
C
will vary depending on the TDP of the individual processor. Refer to thermal profile
figure and associated table for the allowed combinations of power and T
C
.
Extreme Edition 955 3.46 GHz 130 5
1, 2
960 3.60 GHz 130 5
1, 2
950 3.40 GHz 130 5
1, 2
940 3.20 GHz 130 5
1, 2
960 3.60 GHz 95 5
See Table 28
and Figure 14
1, 2
950/945 3.40 GHz 95 5
1, 2
940/935 3.20 GHz 95 5
1, 2
930/925 3 GHz 95 5
1, 2
920/915 2.80 GHz 95 5
1, 2