Datasheet
4 Datasheet
5.2.5 THERMTRIP# Signal................................................................................88
5.2.6 T
CONTROL
and Fan Speed Reduction ...........................................................88
5.2.7 Thermal Diode........................................................................................88
6Features..................................................................................................................91
6.1 Power-On Configuration Options ..........................................................................91
6.2 Clock Control and Low Power States.....................................................................91
6.2.1 Normal State .........................................................................................92
6.2.2 HALT and Enhanced HALT Powerdown States..............................................92
6.2.2.1 HALT Powerdown State ..............................................................92
6.2.2.2 Enhanced HALT Powerdown State................................................93
6.2.3 Stop Grant State ....................................................................................93
6.2.4 Enhanced HALT Snoop or HALT Snoop State,
Stop Grant Snoop State...........................................................................94
6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................94
6.2.4.2 Enhanced HALT Snoop State.......................................................94
6.2.5 Enhanced Intel
®
SpeedStep
®
Technology ..................................................94
7 Boxed Processor Specifications................................................................................95
7.1 Mechanical Specifications....................................................................................95
7.1.1 Boxed Processor Cooling Solution Dimensions.............................................95
7.1.2 Boxed Processor Fan Heatsink Weight .......................................................97
7.1.3 Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly...............................................................................97
7.2 Electrical Requirements ......................................................................................97
7.2.1 Fan Heatsink Power Supply ......................................................................97
7.3 Thermal Specifications........................................................................................99
7.3.1 Boxed Processor Cooling Requirements......................................................99
8 Balanced Technology Extended (BTX) Boxed Processor Specifications...................101
8.1 Mechanical Specifications..................................................................................102
8.1.1 Balanced Technology Extended (BTX) Type I and Type II Boxed Processor
Cooling Solution Dimensions ..................................................................102
8.1.2 Boxed Processor Thermal Module Assembly Weight ...................................104
8.1.3 Boxed Processor Support and Retention Module (SRM) ..............................104
8.2 Electrical Requirements ....................................................................................105
8.2.1 Thermal Module Assembly Power Supply..................................................105
8.3 Thermal Specifications......................................................................................107
8.3.1 Boxed Processor Cooling Requirements....................................................107
8.3.2 Variable Speed Fan...............................................................................108
9 Debug Tools Specifications ....................................................................................111
9.1 Logic Analyzer Interface (LAI) ...........................................................................111
9.1.1 Mechanical Considerations .....................................................................111
9.1.2 Electrical Considerations........................................................................111